Introduction
Hanmi Semiconductor, a key player in the semiconductor market, is riding a wave of demand for its thermal compression (TC) bonders. These advanced tools are critical for stacking memory chips, especially for High Bandwidth Memory (HBM) applications.
With the rapid growth of AI and data-intensive computing, companies like Micron and China’s memory manufacturers are heavily investing in HBM technology. Hanmi Semiconductor is benefitting greatly from this trend, securing significant orders and consolidating its position as a market leader with a 90% share in the TC bonder market.
5 Key Points to Know
Hanmi dominates the TC Bonder market, holding a 90% share, essential for HBM packaging.
Micron invests $14 billion in expanding HBM production, fueling demand for Hanmi’s TC bonders.
China’s memory industry is accelerating its shift to HBM, driving more TC bonder orders.
Hanmi is capitalizing on the global demand for HBM as the memory market scales up for AI and high-performance computing.
TC bonders are integral in memory stacking and packaging, making them a key component in next-gen memory solutions.
Hanmi Semiconductor’s Growing Dominance
Hanmi Semiconductor is a global leader in producing TC bonders, essential tools used to stack memory chips in HBM packaging.
The company holds a commanding 90% market share in the TC bonder sector for HBM3E, a next-generation memory technology that is becoming critical for data-heavy applications like artificial intelligence (AI) and machine learning.
With HBM’s increasing demand, particularly from major players like Micron and Chinese memory manufacturers, Hanmi’s bonders have become indispensable in advanced packaging solutions.
These bonders use thermal compression to bond chips onto processed wafers, enabling higher memory bandwidth essential for performance-driven applications.
Micron’s $14 Billion Investment Fuels Bonder Demand
Micron Technology, a leader in the memory space, has significantly increased its focus on HBM production. In 2025, the company allocated $14 billion of its capital expenditure to expand HBM production, R&D, packaging, and testing capabilities.
Micron ordered 50 TC bonders from Hanmi in 2025. This marks a clear jump from the smaller orders placed in 2024. The move shows Micron’s strong push into the HBM market.
Micron now holds a small share of the HBM space. It wants to raise that share to 20–25%, matching its DRAM position.
The company is building new packaging sites in Singapore, Idaho, Hiroshima, and Taiwan. These expansions drive more demand for Hanmi’s bonders.
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China’s HBM Ambitions Drive Additional Orders
China is becoming a key player in the HBM market. Its memory makers now produce HBM2 and HBM2e at scale.
They aim to start HBM3 production by 2026. This push has increased demand for TC bonders. Chinese firms want to challenge leaders like Micron, SK hynix, and Samsung.
Hanmi Semiconductor stands ready to meet this rising demand. China’s memory expansion creates more orders for Hanmi’s tools. Growing HBM output in China will likely raise global demand for TC bonders. Hanmi is set to keep its lead in this vital market.
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The Rising Importance of TC Bonders in HBM Production
The demand for HBM technology is rapidly increasing as industries such as AI, cloud computing, and gaming require more bandwidth for faster data processing.
As a result, the need for advanced packaging solutions, such as Hanmi’s TC bonders, has never been higher.
These bonders are integral to memory packaging, enabling the high-density stacking required for next-gen memory technologies.
Hanmi Semiconductor’s ability to provide high-quality, efficient bonders has made it a go-to supplier for leading memory makers. As the global demand for HBM increases, Hanmi is set to maintain its position as a top supplier of TC bonders.
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Conclusion
Hanmi Semiconductor’s 90% market share in TC bonders underscores the company’s key role in the global HBM race.
With Micron investing heavily in HBM technology and Chinese memory makers scaling their production, Hanmi is poised to continue benefiting from these shifts.
As HBM continues to drive innovation in memory and data processing, Hanmi’s expertise in TC bonding will remain a cornerstone of the industry’s growth.
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