Introduction
Amkor Technology, Inc. (Nasdaq: AMKR), a global leader in semiconductor packaging and test services, has announced a significant shift in its U.S. expansion strategy. Amkor will build a $2 billion advanced packaging and test facility on a 104-acre site in Chooses Peoria, Arizona, after securing unanimous approval from the Peoria City Council for a land swap agreement.
This move not only strengthens Amkor’s role in the global semiconductor supply chain but also solidifies Arizona’s status as a growing epicenter of U.S. semiconductor manufacturing.
Quick Overview
- New Location Secured: Facility to be built on 104 acres in the Peoria Innovation Core.
- Land Swap Approved: Exchanged 56-acre Vistancia site for larger Innovation Core site.
- Massive Investment: $2 billion capital infusion into Arizona’s semiconductor ecosystem.
- Job Creation: Around 2,000 new high-skilled jobs expected.
- Production Timeline: Construction begins immediately, with operations starting in early 2028.
- Strategic Partners: Will complement TSMC’s fabs and Arizona’s semiconductor cluster.
Why Peoria? Strategic Shifts and Bigger Ambitions
Amkor originally planned to construct its U.S. advanced packaging facility on a 56-acre parcel within the Five North at Vistancia community.

However, the revised plan to relocate to the 104-acre Peoria Innovation Core offers a significant expansion opportunity.
According to Giel Rutten, Amkor’s President and CEO, the move provides greater flexibility to scale operations and respond to customer demand, especially as advanced packaging becomes the next frontier in chip innovation.
“As the largest advanced packaging company in the U.S., Amkor is proud to invest in U.S. semiconductor manufacturing and strengthen the U.S. semiconductor supply chain. This new site offers the flexibility to meet growing customer demand and reinforces our commitment to U.S.-based chip manufacturing,” Rutten stated.
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A Historic Milestone for Peoria
The investment marks one of the largest economic development projects in Peoria’s history. City officials hailed the deal as a landmark moment that will not only boost the local economy but also position Peoria as a key contributor to national semiconductor strategy.
“By securing this land, we are not only bringing a $2 billion investment and 2,000 new jobs to our community, but we are further solidifying the important role Peoria will play in strengthening America’s critical semiconductor supply chain,” said Jason Beck, Mayor of Peoria.
This reflects a broader trend where local governments actively collaborate with semiconductor companies to ensure the U.S. regains competitiveness in this strategic industry.
techovedas.com/16-billion-investment-globalfoundries-boosts-u-s-chip-manufacturing
Why Advanced Packaging Matters
While much of the attention on semiconductors has focused on wafer fabrication and lithography, advanced packaging and testing are equally vital. Chips today are no longer single-function devices; they are increasingly complex systems that combine logic, memory, and interconnects within a single package.
Advanced packaging enables:
- Higher performance for computing and AI workloads.
- Energy efficiency critical for data centers and mobile devices.
- Integration of multiple chips (system-in-package) for automotive and IoT applications.
- Reliability testing to ensure quality before chips enter mass production.
By building this facility, Amkor is positioning itself at the heart of the next wave of semiconductor innovation, ensuring that U.S.-based fabs like TSMC Arizona and Intel Chandler have a domestic partner for high-volume packaging.
techovedas.com/semiconductor-strategy-what-europe-must-learn-from-past-global-failures
Building on Four Decades in Arizona
Amkor is not a newcomer to the region. The company has been part of Greater Phoenix since 1984, operating packaging and testing facilities that serve a wide range of industries.
This long-standing presence has given Amkor a skilled workforce, established infrastructure, and local partnerships that make Arizona an attractive base for expansion.
With this new facility, Amkor is expected to support:
- Computing and Artificial Intelligence: Chips powering data centers and machine learning.
- Communications: 5G and next-generation network processors.
- Automotive: Chips for electric vehicles (EVs) and advanced driver assistance systems (ADAS).
- Consumer Electronics: Smartphones, wearables, and edge devices.
/techovedas.com/amkor-to-build-2-billion-plant-in-usa-packaging-chips-for-tsmc-apple
The Bigger Picture: U.S. Semiconductor Strategy
The U.S. government’s CHIPS and Science Act has been a catalyst for massive investments in domestic semiconductor manufacturing.
TSMC and Intel focus on cutting-edge wafer fabs. Amkor new facility Amkor Chooses Peoria fills a key gap in packaging and testing.
This ensures U.S.-made chips can be packaged and tested domestically. It reduces reliance on Asia, where most packaging is done.
Localizing these steps strengthens U.S. supply chains and lowers risks from geopolitical tensions and shortages.
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Timeline: What Happens Next
- 2025–26: Land preparation and facility construction begin in Peoria.
- 2026–27: Equipment installation and workforce training.
- 2027: Initial trial runs and qualification with key customers.
- Early 2028: Full-scale high-volume production begins.
Conclusion: Arizona’s Rising Semiconductor Hub
Amkor $2 billion investment in Chooses Peoria is more than just a corporate expansion—it’s a strategic bet on the future of U.S. semiconductor resilience. With TSMC building fabs, Intel expanding foundry capacity, and Amkor leading in advanced packaging, Arizona is rapidly emerging as one of the most critical semiconductor hubs outside of Asia.
If wafer fabrication is the heart of the semiconductor industry, advanced packaging is its nervous system. By bringing both under one regional ecosystem, the U.S. is positioning itself to compete at the highest level of the global chip industry.
Arizona is no longer just a desert state; it is becoming the silicon desert of America’s semiconductor future.
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