Introduction
The semiconductor industry has reached a pivotal moment with ASML’s unveiling of its $400 million High-NA (High Numerical Aperture) chipmaking machine.
This technological marvel promises to revolutionize how the world’s most advanced microchips are manufactured.
By enabling unprecedented precision and speed in chip production, ASML’s latest innovation sets a new standard for the entire semiconductor supply chain.
As the demand for smaller, faster, and more efficient chips skyrockets across industries like AI, smartphones, and data centers, this breakthrough machine could be the key to unlocking the next era of computing power.
Key Highlights:
$400 million per unit: ASML’s High NA is the world’s most expensive chipmaking machine.
Only 5 shipped so far: Intel, TSMC, and Samsung are early adopters.
Twice the reliability: Intel reports significant yield and throughput improvements.
Global assembly footprint: Modules come from the U.S., Germany, and the Netherlands.
EUV exclusivity: ASML is the only company globally producing EUV systems.
A Colossal Machine Changing the Chipmaking Landscape
Standing larger than a double-decker bus, the High NA system consists of four modules built across the U.S. (California and Connecticut), Germany, and the Netherlands.
The final assembly and testing occur in Veldhoven before being disassembled again for delivery. It takes seven Boeing 747s or 25 trucks to transport a single machine.
Only five High NA units have been delivered so far, with the first commercial installation at Intel’s Oregon fab in 2024.
ASML expects adoption to expand to all its EUV customers, including Micron, SK Hynix, Rapidus, and others.
What Makes High NA Special?
ASML’s High NA builds on its EUV $400 million legacy by increasing the numerical aperture — the size of the lens opening used to project light onto silicon wafers. A larger aperture allows smaller, more precise patterns to be etched in fewer steps, improving chip performance and reducing production time.
According to ASML’s EVP of Technology Jos Benschop, the two primary benefits of High NA are:
- “Shrink”: Fit more transistors onto a single wafer.
- Faster throughput and higher yield by avoiding multiple patterning.
Intel reported producing 30,000 wafers with High NA and noted the tool is twice as reliable as ASML’s earlier EUV machines. Samsung claimed a 60% reduction in cycle time, indicating the potential for faster chips and lower costs.
The Physics Behind the Process
ASML’s High NA continues to use 13.5nm EUV light, made by firing 50,000 tin droplets per second with a powerful laser, creating plasma hotter than the sun. This light is projected through precision mirrors — the flattest surfaces on Earth — crafted by German optics partner Zeiss.
Because EUV is absorbed by all known materials, the entire lithography process happens in a vacuum, with light bounced and focused using specialized mirrors before reaching the silicon wafer.
Compared to ASML’s older DUV (Deep Ultraviolet) systems that use 193nm light and compete with Nikon and Canon, EUV — and now High NA — allows chipmakers to continue scaling down transistors in line with Moore’s Law.
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A Risk That Paid Off
Developing EUV technology took over 20 years and was once considered an impossible endeavor.
“We barely made it… It’s been a very risky investment because there was no guarantee the technology would work.”ASML CEO Christophe Fouquet recalled,
Since proving EUV’s viability in 2018, ASML has cornered the global market. In 2024, the company sold 44 EUV machines at prices starting from $220 million. DUV sales, while lower-tech, remained strong at 374 units, with China being a key buyer.
Geopolitics and U.S. Export Controls
Despite booming global demand, U.S. export restrictions prevent ASML from selling its EUV machines to China. This ban, originating during Donald Trump’s presidency, remains in effect. China still buys DUV systems, which accounted for 49% of ASML’s sales in Q2 2024, driven by a backlog of orders.
Fouquet expects that figure to return to the historical norm of 20–25% in 2025. However, ASML is bracing for uncertainties, especially as Trump’s new tariff plans could disrupt its 800-part global supply chain. Each High NA machine involves imports and exports between the U.S., Germany, the Netherlands, and Asia.
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Power Efficiency and AI Demands
High NA is not just about precision. It also tackles energy concerns in an AI-driven future. Fouquet warned,
“If we don’t improve the power efficiency of our AI chips, training models could consume the world’s energy by 2035.”
ASML has reduced energy consumption per wafer by 60% since 2018, a crucial milestone as chipmakers seek sustainable growth amid rising demand for compute power.
ASML Expands U.S. Presence
Though headquartered in the Netherlands, ASML is deepening its U.S. footprint. In 2024, 17% of ASML’s sales came from the U.S., a figure expected to grow with new fabs under construction by Intel in Ohio and Arizona.
Of ASML’s 44,000 global employees, 8,500 are U.S.-based, spread across 18 offices. Fouquet called Intel a “very critical” partner for America’s goal of semiconductor independence — even as TSMC remains ahead in advanced manufacturing.
Outlook
ASML’s $400 million High NA system represents a technological leap that could reshape the global semiconductor landscape. With only a handful of companies able to afford it, and only ASML able to build it, the tool solidifies the company’s monopoly on advanced chip lithography.
Yet, challenges remain — from geopolitical tensions and tariffs to energy efficiency and production scalability.
For now, ASML’s High NA machine is not just a feat of engineering; it’s the centerpiece of the battle for semiconductor supremacy.
