5 Key Investments Areas in Semiconductor Sector by China’s Big Fund Phase 3

As China's 14th Five-Year Plan approaches its grand finale, the Big Fund Phase 3 has emerged as a critical instrument in driving semiconductor advancements.

Introduction

China’s semiconductor ambitions have entered a critical phase with the launch of the third round of the National Integrated Circuit Industry Investment Fund, widely known as the “Big Fund.” Backed by a substantial CNY160 billion (approximately US$21.9 billion), this initiative underscores China’s strategic focus on strengthening its domestic semiconductor industry.

As the country reaches the conclusion of its “14th Five-Year Plan,” this move reflects its commitment to self-sufficiency in chip production amid ongoing geopolitical tensions.

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Overview

Here’s a quick look at what the Big Fund Phase 3 means for China’s semiconductor industry:

  1. Massive Investment: The Big Fund Phase 3 brings in CNY160 billion to bolster domestic semiconductor manufacturing.
  2. Strategic Timing: It coincides with the final year of the “14th Five-Year Plan,” reflecting a sense of urgency.
  3. Sector Focus: Investments will prioritize chip design, manufacturing equipment, and advanced materials.
  4. Geopolitical Context: The initiative comes amid growing pressure from U.S.-led export controls on semiconductor technology.
  5. Private Sector Role: Alongside state funding, private enterprises are expected to play a key role in achieving technological breakthroughs.

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Background on China’s Semiconductor Push

China’s semiconductor journey began in earnest in the early 2000s, but it gained significant traction with the launch of the first phase of the Big Fund in 2014. This initiative aimed to reduce reliance on foreign suppliers by investing in key segments of the supply chain, including chip design, fabrication, and packaging.

The second phase, launched in 2019 with a similar budget, focused on advanced semiconductor technologies and production expansion. Despite facing significant hurdles, such as U.S. export restrictions on critical technologies, China managed to increase its global market share in semiconductor manufacturing during this period.

As Phase 3 kicks off, the focus shifts toward closing the technology gap with global leaders such as the U.S., South Korea, and Taiwan.

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Key Areas of Investment

Phase 3 of the Big Fund will target several critical areas:

  1. Chip Design China’s goal is to develop homegrown design capabilities for advanced processors and memory chips. With increasing demand for AI, IoT, and 5G applications, enhancing chip design expertise is crucial.
  2. Semiconductor Equipment A major hurdle for China’s chip industry has been its dependence on imported manufacturing equipment. Phase 3 will allocate significant resources to developing indigenous lithography machines, etching tools, and deposition systems.
  3. Materials The program also aims to improve the domestic production of semiconductor-grade materials, including silicon wafers, photoresists, and specialty chemicals. Developing a robust materials ecosystem will reduce vulnerabilities in the supply chain.
  4. Advanced Packaging Advanced packaging technologies, such as 3D stacking and heterogeneous integration, are crucial for improving chip performance. China plans to invest heavily in R&D for these technologies.
  5. Talent Development Building a skilled workforce is another priority. Collaborations with universities, research institutions, and global industry experts are expected to enhance training programs.

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Why Now? Strategic Importance of the Timing

The timing of this new investment phase is significant. It aligns with the final year of China’s “14th Five-Year Plan,” which emphasizes technological self-reliance. Additionally, escalating trade tensions and export controls imposed by the U.S. on advanced chip technologies have made it imperative for China to accelerate its semiconductor development efforts.

According to industry analysts, the Big Fund Phase 3 aims not only to secure supply chains but also to position China as a major player in the global semiconductor landscape by 2030.

Private Sector Involvement

Unlike previous phases, Phase 3 encourages more participation from private enterprises. Major Chinese tech giants such as Alibaba, Tencent, and Huawei are expected to contribute by investing in semiconductor startups and R&D initiatives.

ByteDance, known for its AI-driven platforms, has already ramped up its semiconductor investments, rivaling the combined spending of China’s traditional tech heavyweights (commonly referred to as BAT—Baidu, Alibaba, Tencent). This signals a broader trend of tech companies diversifying into chip development.

Challenges Ahead

While the Big Fund Phase 3 brings optimism, significant challenges remain:

  1. Technological Bottlenecks: Despite progress, China still lags behind in critical areas like extreme ultraviolet (EUV) lithography.
  2. Export Controls: Continued restrictions on advanced semiconductor technology exports from the U.S. and its allies could slow down China’s progress.
  3. Global Competition: Countries such as the U.S., South Korea, and Japan are also ramping up investments in semiconductor R&D, intensifying global competition.

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Potential Impact on the Global Market

If successful, the Big Fund Phase 3 could significantly alter the global semiconductor landscape. Increased production capacity in China could lead to:

  • Lower costs for certain types of chips.
  • Reduced dependence on a few dominant players.
  • Increased competition in areas like AI chips and 5G semiconductors.

Moreover, it could force other countries to revisit their own semiconductor strategies, potentially leading to more government-backed initiatives worldwide.

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Conclusion

China’s launch of the Big Fund Phase 3 represents a bold step toward achieving semiconductor self-reliance. With a substantial CNY160 billion investment, strategic focus on key technologies, and active involvement of both public and private sectors, the country aims to overcome existing challenges and emerge as a global leader in semiconductor innovation. As geopolitical tensions continue to influence the industry, China’s progress in this area will be closely watched by both competitors and partners alike.

By aligning with the goals of the “14th Five-Year Plan,” this initiative not only addresses current vulnerabilities but also sets the stage for long-term growth in a critical sector that underpins the modern digital economy.

 

Kumar Priyadarshi
Kumar Priyadarshi

Kumar Joined IISER Pune after qualifying IIT-JEE in 2012. In his 5th year, he travelled to Singapore for his master’s thesis which yielded a Research Paper in ACS Nano. Kumar Joined Global Foundries as a process Engineer in Singapore working at 40 nm Process node. Working as a scientist at IIT Bombay as Senior Scientist, Kumar Led the team which built India’s 1st Memory Chip with Semiconductor Lab (SCL).

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