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6 Leading Companies in Advanced Packaging of Integrated Circuits

Introduction

Semiconductor packaging plays a crucial role in the functionality, performance, and reliability of integrated circuits (ICs) and semiconductors. As the demand for smaller, faster, and more efficient electronic devices continues to rise, companies specializing in advanced packaging technologies are at the forefront of innovation. We explore 6 Leading Companies in Advanced Packaging of Integrated Circuits.

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What is Advanced Packaging?

Advanced packaging refers to the technologies and methods used in the design and manufacturing of semiconductor devices beyond the traditional chip packaging techniques. These advanced packaging methods are crucial for achieving higher performance, increased functionality, improved power efficiency, and smaller form factors in electronic devices.

Read All about Advanced Packaging here

6 Leading Companies in Advanced Packaging of Integrated Circuits

1. Amkor Technology:

Amkor Technology stands out as a leading provider of outsourced semiconductor packaging and test services. With a diverse portfolio of advanced packaging technologies, including fan-out wafer-level packaging (FO-WLP), system-in-package (SiP), and 2.5D/3D interposer technology, Amkor is well-positioned to address the evolving needs of the semiconductor industry. Their commitment to innovation and customer satisfaction has solidified their position as a trusted partner for semiconductor companies worldwide.

An example of their innovation is the 2.5D/3D interposer technology used in high-performance computing applications. This technology allows for multiple dies to be stacked vertically, enabling higher bandwidth, lower power consumption, and smaller form factors compared to traditional packaging methods.

Read More: What is 2D, 2.5D & 3D Packaging of Integrated Chips?

2. Advanced Semiconductor Engineering (ASE):

ASE holds the distinction of being the world’s largest outsourced semiconductor packaging and test company. Leveraging their extensive experience and expertise, ASE offers a broad range of advanced packaging technologies, such as flip chip, fan-out, and embedded die packaging. Their dedication to research and development ensures that they remain at the forefront of semiconductor packaging innovation, providing cutting-edge solutions to meet the demands of today’s market.

ASE offers a broad range of advanced packaging technologies, including flip chip packaging. Flip chip packaging flips the semiconductor die upside down and directly connects it to the substrate, reducing interconnect length and improving electrical performance. This widely-used technology finds applications in high-performance computing, mobile devices, and automotive systems.

Read More: What is Heterogeneous integration: Advantages Types and Technology

3. Taiwan Semiconductor Manufacturing Company (TSMC):

TSMC, known primarily as the world’s largest foundry, has also made significant strides in advanced packaging services. Their investment in new packaging technologies, including CoWoS (chip-on-wafer-on-substrate) and advanced interposers, demonstrates their commitment to driving innovation in semiconductor packaging. By offering integrated solutions that combine advanced packaging with leading-edge manufacturing processes, TSMC continues to be a key player in the semiconductor ecosystem.

TSMC’s Chip-on-Wafer-on-Substrate (CoWoS) technology is a prime example of their commitment to innovation in semiconductor packaging. CoWoS enables the integration of multiple dies onto a single package, interconnected through a silicon interposer. This approach offers higher bandwidth, reduced power consumption, and improved signal integrity. This makes it ideal for advanced computing and networking applications.

Read More: What are 5 Techniques in Advanced Packaging?

4. Intel:

Intel, a major integrated device manufacturer (IDM), has been actively developing advanced packaging technologies to complement its high-performance computing products. Through initiatives like Foveros and EMIB (Embedded Multi-Die Interconnect Bridge), Intel aims to deliver enhanced performance, power efficiency, and scalability to its customers.

Intel’s Foveros technology exemplifies their dedication to advancing semiconductor packaging. Foveros enables the stacking of multiple logic die vertically, connected through through-silicon vias (TSVs). This approach allows for heterogeneous integration, combining different process technologies and functional blocks on a single package. This results in improved performance, power efficiency, and form factor.

Read More: What are Top Foundries: Tech node Capability & Applications

5. Samsung Electronics:

Samsung Electronics, another prominent IDM, has been investing heavily in advanced packaging. This is done to support its diverse product portfolio, including mobile and automotive applications. Their proprietary packaging technologies, such as XGAon and XCube, highlight their commitment to delivering innovative solutions that meet the evolving needs of the market. Samsung’s focus on research and development ensures that they remain at the forefront of semiconductor packaging innovation.

Samsung’s XGAon technology is a noteworthy example of their innovation in semiconductor packaging. XGAon stands for “extreme geometric accuracy on a nano scale,” and it involves the precise placement and alignment of semiconductor components on a package substrate. This technology enables higher levels of integration, improved electrical performance, and enhanced reliability, particularly in mobile and automotive applications.

Read More: 3 Course to Master Chip Packaging from Basic to Advanced in 24 hours

6. JCET Group:

JCET Group is a leading provider of packaging and test services for integrated circuits (ICs) and semiconductors. With a comprehensive suite of advanced packaging solutions, including FO-WLP, SiP, and CoWoS, JCET Group caters to a wide range of industries and applications. Their dedication to quality, reliability, and technological advancement has earned them a reputation as a trusted partner for semiconductor companies worldwide.

JCET Group’s Fan-Out Wafer-Level Packaging (FO-WLP) technology demonstrates their expertise in advanced packaging solutions. FO-WLP redistributes active components from the semiconductor wafer to a larger package substrate, offering design and integration flexibility. It brings benefits in size, cost, and performance, suitable for various applications like consumer electronics and IoT devices.

Read More: 5 Reasons Chips Need Advanced Packaging

Conclusion:

In conclusion, the advancements in semiconductor packaging achieved by these six leading companies underscore the critical role of Advanced packaging technology in driving innovation and enabling the development of next-generation electronic devices.

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