China has made a 7 nm Chip.
China has made World' most advanced 3D Nand.
They are working toward stock piling legacy chips.
On the other hand, US bans are hurting US companies business.
TechInsights has not seen a Quad-Level Cell (QLC) 3D NAND die with more than two hundred active word lines before, making this discovery a significant first.
In August, TSMC announced its partnership with prominent European firms, including Robert Bosch, Infineon Technologies, and NXP Semiconductors, to create the European Semiconductor Manufacturing Company (ESMC).
From 2023 to 2027, the global ratio of mature (>28nm) to advanced (<16nm) processes is projected to hover around 7:3, with China's mature process capacity anticipated to grow from 29% in 2023 to 33% by 2027.
“Because TSMC also gets good, well-trained technicians, and even well-trained operators from a lot of trade schools in Taiwan. … Their students aspire to make a good living as technicians.”
~Morris Chang at MIT
This innovative architecture has been upgraded specifically for this memory, enabling it to match the I/O speed of existing NAND flash with 200 layers and more.
Typically, such subsidies cover about one-third of the project cost. Therefore, the additional subsidy of 900 billion yen(~6B$) represents a substantial financial contribution, with the government anticipated to shoulder more than one-third of the total project cost.
In a bold move to challenge Intel's long-standing dominance in the desktop CPU market, Qualcomm introduced its first custom Arm CPU, the Oryon CPU.
Dutch Trade Minister Liesje Schreinemacher has voiced her government's willingness to cooperate with the U.S. while emphasizing the need for a more European-centric strategy in addressing these trade restrictions.
The restrictions prevent companies like NVIDIA from utilizing workarounds to sell high-compute chips to China, leading to the isolation of the Chinese market from advanced semiconductor technology.
