CDIL becomes first Indian company to produce SiC Devices

Continental Device India Limited (CDIL) has made history by inaugurating a groundbreaking surface mount semiconductor packaging line in Mohali, India. This move positions CDIL as a pioneer, being the first Indian company to delve into the production of Silicon Carbide (SiC) components—a technology promising superior efficiency and power-handling capabilities.

Introduction:

Continental Device India Limited (CDIL) has marked a significant milestone in the semiconductor industry by inaugurating a state-of-the-art surface mount semiconductor packaging line at its Mohali-based plant. This development positions CDIL as the first Indian company to commence production of Silicon Carbide (SiC) components, showcasing India’s stride towards advanced semiconductor manufacturing. This blog post will delve into the specifics of this remarkable achievement and its implications for the market.

Follow us on Linkedin for everything around Semiconductors & AI

SiC Technology and Its Advantages:

Silicon Carbide (SiC) is a cutting-edge material in the semiconductor domain, offering substantial improvements in efficiency and power-handling capabilities. Particularly in high-power charging applications and battery management systems, SiC technology has proven to be a game-changer. SiC-based components can operate at higher temperatures and voltages, leading to enhanced performance and reliability.

CDIL’s Strategic Expansion:

CDIL inaugurated a new semiconductor packaging line. It meets demand for EVs, power devices, solar panels, and wide-band gap electronics. They scale up for auto-grade devices. The line manufactures various SiC components: MOSFETs, Schottky Diodes, Rectifiers, Zeners, TVS Diodes.

Capacity Expansion and MeitY’s SPECS Scheme:

The expansion of assembly lines under the MeitY’s SPECS scheme is a pivotal move to boost CDIL’s annual capacity by 100 million units. The initial phase of production, featuring a surface mount packaging line with a capacity of 50 million devices, has been successfully initiated. This enhanced capacity will play a crucial role in meeting the surging demand for SiC components globally.

Collaborations and Research Endeavors:

The MoU intends to leverage SCL’s expertise and fabrication facilities for producing specialized wafers for CDIL’s semiconductor devices using their unique manufacturing processes.

To ensure the highest quality and reliability of their devices, CDIL has established an advanced high reliability (HiRel) and testing laboratory in Mohali. This facility is dedicated to qualifying CDIL’s devices for stringent sectors like automotive, defense, and aerospace. These efforts underscore CDIL’s commitment to providing top-tier, reliable semiconductor solutions.

Conclusion:

CDIL’s venture into SiC component production and the expansion of its semiconductor packaging lines demonstrate their commitment to leading in semiconductor technology. This move will not only benefit the domestic market but also have a noteworthy impact globally. CDIL’s strategic collaborations and investments in advanced facilities affirm its position as an industry pioneer shaping India’s semiconductor manufacturing future.

Editorial Team
Editorial Team
Articles: 1901