Introduction
The semiconductor industry in China has taken a major leap forward, with the official commissioning of top 5 New 12-inch wafer production lines. By the close of 2024, key projects from Runpeng Semiconductor, Tiancheng Advanced, Yandong Microelectronics, Guangzhou Chip Semiconductor, and Hua Hong Wuxi began production.
These facilities aim to boost China’s domestic capacity for power devices and advanced logic chips, crucial for meeting growing global demand.
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Overview of Key Developments
- Launch of Five New 12-Inch Wafer Lines: Runpeng Semiconductor, Tiancheng Advanced, Yandong Micro, Guangzhou Chip Semiconductor, and Hua Hong Wuxi have officially commenced production.
- Significant Investments: Companies are investing billions of RMB to bolster production capacities.
- Advanced Technologies: Facilities focus on cutting-edge technologies, such as power devices, TSV (Through Silicon Via), and analog specialty processes.
- Capacity Expansion Plans: SMIC and Zensemi aim to significantly increase their production capabilities in 2025.
- Strategic Importance: These developments enhance China’s position in the global semiconductor market, supporting key industries like automotive and consumer electronics.
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Why 12-Inch Wafer Fabs Matter
12-inch wafer fabs are essential to semiconductor manufacturing. They enable the production of larger volumes of chips at lower costs per unit compared to smaller wafers. These chips power cutting-edge technologies, including consumer electronics, electric vehicles, and industrial applications. The new production lines signal China’s increasing focus on strengthening its semiconductor supply chain.
Key Highlights of China’s 12-Inch Wafer Expansion
- Runpeng Semiconductor’s IC Production Line
- Launched: December 31, 2024
- Annual Capacity: 480,000 12-inch power chips
- Focus: Power semiconductor devices
- Tiancheng Advanced’s TSV Line
- Launched: December 30, 2024
- Technology: Through Silicon Via (TSV)
- Benefits: High capacity, low power consumption, enhanced density
- Yandong Micro’s Fundraising for New Line
- Investment: RMB 4.02 billion
- Purpose: Beidian Integrated 12-inch IC production line
- Guangzhou Chip Semiconductor Phase III Completion
- Capacity: 40,000 wafers monthly
- Technology: 180-90nm process for industrial and automotive-grade chips
- Hua Hong Wuxi Production Line
- Investment: Over USD 10 billion
- Phase II Launch: December 10, 2024
AI to Contribute $19.9 Trillion to Global Economy by 2030, Driving 3.5% of Global GDP – techovedas
Project Details
1. Runpeng Semiconductor Kicks Off Production
Runpeng Semiconductor marked the launch of its 12-inch integrated circuit (IC) production line with a ribbon-cutting ceremony on December 31, 2024. The facility, once fully operational, will produce 480,000 power chips annually. These chips are critical for power management in various high-demand sectors, including electric vehicles and renewable energy systems.
2. Tiancheng Advanced’s TSV Innovation
Zhuhai Tiancheng Advanced announced its 12-inch wafer-level TSV production line on December 30, 2024. This advanced technology integrates multiple chips vertically, reducing power consumption and improving performance. The commissioning of this line highlights China’s focus on next-generation semiconductor manufacturing.
3. Yandong Micro’s Strategic Fundraising
Beijing Yandong Microelectronics secured RMB 4.02 billion to fund its Beidian Integrated 12-inch IC production line. The company plans to use RMB 4 billion of this amount for project development. This new line aims to enhance Yandong Micro’s role in China’s semiconductor ecosystem.
4. Guangzhou Chip Semiconductor’s Major Milestone
Guangzhou Chip Semiconductor completed Phase III of its 12-inch wafer project on December 28, 2024. The facility, located in the Guangzhou Development Zone, will specialize in analog specialty processes using 180-90nm technology. This development adds a monthly capacity of 40,000 wafers and is projected to generate an annual output of RMB 4 billion.
5. Hua Hong Wuxi’s Expansion
Hua Hong Group completed Phase II of its Wuxi IC R&D and manufacturing base on December 10, 2024. With an investment exceeding USD 10 billion since its inception in 2018, the facility has transitioned to full-scale production. Hua Hong Wuxi’s new line will significantly enhance China’s domestic chip production capabilities.
SMIC and Zensemi: Steady Progress
In addition to these milestones, other notable developments include:
- SMIC’s Capacity Expansion
By the end of 2024, SMIC increased its 12-inch wafer production capacity by 60,000 wafers per month. This expansion supports the production of advanced logic chips and enhances China’s semiconductor self-reliance. - Zensemi’s Manufacturing Success
Zensemi achieved a 99.7% first-pass yield on its initial product batch, a key indicator of manufacturing efficiency. The company plans to deliver 10,000 wafers by the end of 2024 and ramp up to 20,000 wafers per month in 2025.
AI to Contribute $19.9 Trillion to Global Economy by 2030, Driving 3.5% of Global GDP – techovedas
Conclusion
China’s latest achievements in 12-inch wafer production underscore the nation’s commitment to advancing its semiconductor industry. These facilities not only address rising global demand but also establish a robust foundation for technological innovation. By focusing on both capacity and cutting-edge technologies, China is positioning itself as a leading player in the global semiconductor landscape.
