China’s second-largest chip foundry Appoints Former Intel Executive as New President

Bai Peng Appointed as New President of Hua Hong Semiconductor, Former Intel Executive

Introduction

China’s second-largest chip foundry, Hua Hong Semiconductor, has appointed Bai Peng, a veteran with over 30 years of semiconductor experience, as its new president. The appointment comes amid significant changes in the company’s management and growing challenges in China’s semiconductor sector.

Bai’s extensive background includes key roles at global tech giant Intel and other semiconductor firms, positioning him as a pivotal figure for Hua Hong’s future.

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Key Points at a Glance

  1. Leadership Shift: Hua Hong Semiconductor names Bai Peng as president on a three-year term.
  2. Veteran Expertise: Bai brings decades of experience in semiconductor fabrication, including leadership roles at Intel.
  3. New Plant in Operation: Hua Hong recently launched a facility in Wuxi, signaling expansion efforts.
  4. Market Context: The company holds a 2.2% share in the global foundry market, largely supported by domestic demand.
  5. Challenges Ahead: The U.S.-China tech rivalry creates headwinds, particularly for legacy semiconductor production.

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Bai Peng: A Veteran in the Semiconductor Industry

Bai Peng, 62, is the new president of Hua Hong Semiconductor. He has a long career in the semiconductor industry. Bai graduated from Peking University and earned a bachelor’s degree in physics from the University of Bucharest in 1985. He also holds a doctorate in physics from Rensselaer Polytechnic Institute in New York.

Bai spent over 20 years at Intel, where he was global vice-president. He led advancements in process integration, yield engineering, and R&D.

Most recently, Bai was CEO of Rong Semiconductor (Ningbo) Co. This company specializes in image sensors, power management chips, and display drivers. Bai’s expertise in mature node technologies, from 28-nanometre to 180-nm, aligns with Hua Hong’s focus on legacy semiconductor manufacturing.

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Expansion and Strategic Moves

Hua Hong Semiconductor has been bolstering its manufacturing capabilities. In late 2024, the company began operations at a new facility in Wuxi, Jiangsu province. This plant is expected to enhance Hua Hong’s production capacity and support its specialization in mature-node technology, catering to industries like automotive, IoT, and consumer electronics.

The expansion reflects Hua Hong’s ambition to secure a larger share of the semiconductor market, even as it grapples with external pressures like U.S. trade restrictions targeting China’s chip sector.

Market Position and Performance

In the third quarter of 2024, Hua Hong ranked as the sixth-largest foundry globally, according to TrendForce. The company reported a market share of 2.2%, a slight dip from the 2.6% recorded in the same period a year earlier. Hua Hong’s revenue stood at $526.3 million, with 82% generated from mainland China and only $47.6 million from U.S. customers.

Despite its modest global share, Hua Hong plays a critical role in China’s domestic semiconductor ecosystem. Its close ties with local chip design firms underscore its importance in the country’s push for technological self-reliance.

Challenges in the Semiconductor Sector

The appointment of Bai Peng comes at a time when the Chinese semiconductor industry is navigating complex challenges. The U.S. government has intensified trade investigations and restrictions on China’s chip production capabilities. Hua Hong, which focuses on legacy semiconductor technologies, is directly impacted by these measures.

China’s reliance on imported semiconductors for critical industries, including automotive and electronics, underscores the need for firms like Hua Hong to enhance local capabilities. However, achieving this goal requires addressing technology bottlenecks and geopolitical headwinds.

Management Reshuffle and Future Outlook

Bai Peng’s appointment follows other leadership changes at Hua Hong Group, the parent company. Qin Jian was recently named chairman, replacing Zhang Suxin, who had held the position since 2016.

These changes signal a strategic shift aimed at positioning Hua Hong for long-term growth in a competitive and politically charged market.

The company’s focus on mature-node technology aligns with growing demand in specific sectors like automotive electronics and industrial IoT. With Bai’s leadership and experience, Hua Hong aims to navigate challenges, strengthen its domestic market presence, and explore opportunities for global expansion.

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Conclusion

Hua Hong Semiconductor’s decision to bring Bai Peng on board marks a strategic move to strengthen its position in the semiconductor industry. His expertise and leadership come at a critical time, as the company contends with domestic and international pressures. With new facilities and an experienced team, Hua Hong is poised to play a pivotal role in China’s semiconductor ambitions.

Kumar Priyadarshi
Kumar Priyadarshi

Kumar Joined IISER Pune after qualifying IIT-JEE in 2012. In his 5th year, he travelled to Singapore for his master’s thesis which yielded a Research Paper in ACS Nano. Kumar Joined Global Foundries as a process Engineer in Singapore working at 40 nm Process node. Working as a scientist at IIT Bombay as Senior Scientist, Kumar Led the team which built India’s 1st Memory Chip with Semiconductor Lab (SCL).

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