CoWoS: TSMC’s New Secret Weapon for Advanced Packaging

TSMC’s CoWoS technology has become a pivotal player in the production of AMD’s Instinct MI300 advanced chiplets. Moreover, Nvidia’s choice to manufacture its H100 with TSMC solidifies their strong reliance on the company, given TSMC’s exclusive capability for high-volume manufacturing of such designs at a reasonable cost. Consequently, Nvidia and AMD collectively represent a substantial share of TSMC’s CoWoS production capacity.