DRDO Develops Groundbreaking Silicon Carbide Wafers and GaN HEMTs for Next-Gen Applications

DRDO's breakthrough in Silicon Carbide (SiC) and Gallium Nitride (GaN) technology paves the way for advanced defense systems and green energy solutions.

Introduction

The Defence Research and Development Organisation (DRDO) has made a significant leap forward in semiconductor technology, with its Solid State Physics Laboratory (SSPL) successfully developing advanced Silicon Carbide (SiC) wafers and Gallium Nitride (GaN) High Electron Mobility Transistors (HEMTs).

These innovations are expected to revolutionize both defense and clean energy sectors, paving the way for high-efficiency, compact, and reliable technologies essential for modern systems.

Key Developments in GaN and SiC Technology

  • Indigenous SiC Wafers: DRDO has developed 4-inch Silicon Carbide wafers, providing a solid foundation for power systems.
  • High-Power GaN HEMTs: The laboratory has also produced GaN HEMTs capable of handling up to 150W, improving performance in energy-intensive applications.
  • MMIC Advancements: DRDO’s development includes Monolithic Microwave Integrated Circuits (MMICs) with power capabilities up to 40W, supporting frequencies extending into the X-band.
  • Multifunctional Applications: The new technology serves multiple purposes in defense, aerospace, and clean energy fields.
  • Impact on Green Energy: The GaN/SiC technology is set to contribute to India’s green energy goals, powering electric vehicles and renewable energy systems.

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Background of the Technology

India’s semiconductor industry has historically been dependent on imported components, especially in critical sectors like defense and aerospace. To bridge this gap, DRDO’s Solid State Physics Laboratory has focused on developing indigenous semiconductor materials, which are crucial for powering next-generation defense equipment, radar systems, and energy-efficient technologies. The development of SiC wafers and GaN HEMTs represents a major step towards technological self-reliance, reducing dependence on foreign suppliers for essential components.

Silicon Carbide is renowned for its ability to operate in extreme conditions, such as high temperatures and voltages. This makes it an ideal choice for defense systems that require durable, high-performance components.

Gallium Nitride, on the other hand, offers significant advantages in high-frequency applications.

GaN’s high electron mobility and thermal conductivity make it well-suited for systems like radar, communications, and electronic warfare, where performance at high frequencies and power levels is crucial.

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Significance in Defense and Aerospace Applications

The GaN/SiC technology developed by DRDO holds immense potential for improving India’s defense capabilities. The high power and frequency characteristics of these materials are ideal for radar, communication, and electronic warfare systems. GaN HEMTs can handle up to 150W, improving power efficiency and enabling compact, lighter defense systems. The development of MMICs with 40W power capability enhances strategic defense applications. MMICs are vital for advanced communication systems. These advancements position DRDO as a global leader in semiconductors. The technology could strengthen India’s defense, particularly in autonomous systems, reconnaissance, and intelligence.

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Expanding to Commercial and Green Energy Sectors

While these advancements are vital for defense, they also have significant implications for commercial sectors. GaN/SiC technology benefits the electric vehicle (EV) market by improving energy efficiency and range.

It also supports renewable energy systems, advancing India’s green energy goals. Producing high-power GaN HEMTs and SiC wafers allows India to become a key player in the global semiconductor market.

By integrating defense and commercial applications, India can diversify its semiconductor ecosystem, ensuring broader benefits beyond military use.

The Future of GaN and SiC in Strategic Systems

One of the most exciting aspects of this development is its potential to impact space exploration and satellite communications.

As the demand for high-power, high-frequency systems grows in aerospace and space sectors, GaN/SiC technology will power communication satellites, space missions, and radar systems.

The GaN-on-SiC MMIC production facility at GAETEC in Hyderabad is a key development. DRDO now has the capability to manufacture multifunctional MMICs for applications in defense, space exploration, and 5G/satellite communications.

Boosting India’s Technological Capabilities

This breakthrough in GaN and SiC technology strengthens India’s position as a self-reliant nation in semiconductor research and manufacturing.

The government’s focus on making India a hub for next-gen technologies reduces dependence on foreign tech in key sectors.

DRDO’s success will drive further advancements in semiconductor technology, with opportunities for commercialization.

This progress supports renewable energy, job creation in semiconductors, and partnerships with global tech firms.

It marks a new era for India’s tech ecosystem, where domestic innovation shapes defense, space, and clean energy futures.

Conclusion: A New Era in Semiconductor Technology

DRDO’s development of Silicon Carbide wafers and GaN HEMTs represents a milestone for India’s defense and commercial industries.

DRDO is enhancing India’s defense capabilities with indigenous solutions for high-power, high-frequency applications. These advancements also support global green energy goals.

India is emerging as a leader in semiconductor innovation, influencing industries like aerospace and electric vehicles.

The successful development of MMIC production, SiC, and GaN technologies positions India at the forefront of strategic systems and clean energy, both in defense and beyond.

Kumar Priyadarshi
Kumar Priyadarshi

Kumar Priyadarshi is a prominent figure in the world of technology and semiconductors. He is the founder of Techovedas, India’s first semiconductor and AI tech media company, where he shares insights, analysis, and trends related to the semiconductor and AI industries.

Kumar Joined IISER Pune after qualifying IIT-JEE in 2012. In his 5th year, he travelled to Singapore for his master’s thesis which yielded a Research Paper in ACS Nano. Kumar Joined Global Foundries as a process Engineer in Singapore working at 40 nm Process node. Working as a scientist at IIT Bombay as Senior Scientist, Kumar Led the team which built India’s 1st Memory Chip with Semiconductor Lab (SCL).

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