Introduction
Foxconn, the world’s leading electronics manufacturer, has announced a significant €250 million investment to establish Europe’s first Fan-Out Wafer-Level Packaging (FOWLP) facility in France.
This move marks a strategic step in strengthening Europe’s semiconductor supply chain amid rising global demand for advanced chip packaging technologies.
Fan-Out packaging is a breakthrough technology that enables smaller, faster, and more energy-efficient semiconductor devices, crucial for industries like automotive, aerospace, 6G communications, and defense.
By partnering with French tech giants Thales and Radiall, Foxconn aims to bring cutting-edge chip assembly and testing capabilities closer to European markets, reducing dependency on overseas suppliers and supporting the continent’s push for semiconductor self-reliance under the EU Chips Act.
Key Highlights
€250 million investment announced by Foxconn in France.
Europe’s first Fan-Out Wafer-Level Packaging (FOWLP) plant to be built.
Joint venture formed with Thales and Radiall for OSAT (Outsourced Semiconductor Assembly and Test) operations.
Strategic partnership with Thales to develop LEO satellites.
New moves expand Foxconn’s presence in semiconductors, aerospace, and satellite ecosystems.
A Strategic Leap into Europe’s Semiconductor Supply Chain
Foxconn, also known as Hon Hai Precision Industry, has unveiled a major €250 million investment in France aimed at establishing Europe’s first advanced semiconductor packaging and testing facility using Fan-Out Wafer-Level Packaging (FOWLP) technology.
The announcement was made on May 19, as reported by Economic Daily News, and marks a critical expansion of Foxconn’s global chip packaging footprint.
This move comes amid growing European efforts to boost local semiconductor capabilities under the EU Chips Act.
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Europe’s First Advanced OSAT Facility
The new plant will be developed through a joint venture with French aerospace and electronics leaders Thales and Radiall.
It will focus on OSAT services using FOWLP, a cutting-edge chip packaging method known for increasing performance and reducing size — ideal for compact, high-speed applications in automotive, defense, and 6G communications.
| Feature | Details |
|---|---|
| Investment Value | €250 million |
| Location | France |
| Technology | Fan-Out Wafer-Level Packaging (FOWLP) |
| Initial Target Market | Europe (automotive, aerospace, defense, 6G) |
| Partners | Thales, Radiall |
Strengthening the Satellite Ecosystem
Foxconn also announced a strategic satellite partnership with Thales, combining Thales’ expertise in space systems with Foxconn’s precision manufacturing. The two companies aim to co-develop satellites for low Earth orbit (LEO) constellations, with a focus on high-volume, high-quality production.
This aligns with Foxconn’s broader ambition to play a major role in the global satellite supply chain. In 2023, Foxconn launched its self-developed PEARL CubeSat, a key milestone in its entry into space technology.
Jesse Chao, Head of Foxconn’s B5G Strategy, said LEO satellites could be crucial for 5G and 6G networks over the next decade.
Deepening Space Tech Collaborations
To support its space ambitions, Foxconn has built a growing ecosystem around LEO satellite development. According to Economic Daily News, collaborations include:
- A LEO user terminal by FIH Mobile and Sharp.
- An Earth observation camera module by Rayprus.
- Space-grade connectors and cables by Foxconn Interconnect Technology (FIT).
These product is expect to form a standardized, mass-producible satellite supply chain, enabling faster deployment of LEO networks globally.
Expanding Beyond Semiconductors
Foxconn is not stopping at chips and satellites. It’s also moving fast in the electric vehicle (EV) sector. Its EV unit, Foxtron Vehicle Technologies, recently signed an MoU with Mitsubishi Motors. The deal will have Foxtron lead design and manufacturing for an EV expected to launch in Australia and New Zealand by late 2026.
What This Means for Europe
This investment represents Foxconn’s growing commitment to Europe — aligning with the continent’s strategy to reduce reliance on foreign semiconductor supply chains. The FOWLP plant will also provide critical OSAT capabilities that are currently limited in Europe.
At the same time, Foxconn’s space and EV ventures showcase its push to diversify beyond traditional electronics manufacturing. With semiconductors, satellites, and EVs in its portfolio, Foxconn is evolving into a high-tech, vertically integrated powerhouse.
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Conclusion
Foxconn’s €250 million investment in France is more than just a factory — it’s a strategic foothold in Europe’s tech sovereignty ambitions.
With cutting-edge FOWLP packaging, advanced satellite collaborations, and expanding EV ventures, Foxconn is positioning itself at the heart of multiple future-facing industries.
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