Introduction
China has quietly achieved something that could reshape the global semiconductor landscape. Zhejiang Jingsheng Mechanical & Electrical has announced the launch of the world’s first fully localized 12-inch silicon carbide (SiC) production line, signaling a major leap toward semiconductor independence.
Commissioned on September 26, 2025, at its subsidiary SuperSiC, the pilot line marks the first time China has produced large SiC wafers using 100% domestically developed equipment — a milestone that seemed out of reach just a few years ago.
5 Key Highlights
- China achieves 100% localization of all SiC equipment for the first time.
- 12-inch wafers yield 2.5× more chips than 8-inch wafers, slashing costs by 40%.
- China’s SiC market share is projected to rise from 35% in 2024 to 60% in 2025.
- EVs and AI data centers emerge as new demand engines for SiC devices.
- NVIDIA may adopt SiC interposers for its next-gen Rubin GPU architecture.
China’s Big Leap: From 8-Inch to 12-Inch SiC
For years, the global silicon carbide (SiC) industry was dominated by Western players such as Wolfspeed, STMicroelectronics, and onsemi. Most of China’s SiC wafers depended on imported tools and materials.
That dependency is now breaking.
Zhejiang Jingsheng’s 12-inch SiC pilot line — developed entirely in-house — represents a full supply chain breakthrough. From crystal growth to wafer cutting, polishing, and inspection, every process now runs on Chinese-made machinery.
This level of localization is historic. It doesn’t just lower costs; it strengthens China’s technological sovereignty in a field that powers everything from electric vehicles (EVs) to AI servers and 5G infrastructure.
techovedas.com/2-billion-boost-onsemi-ambitious-expansion-in-czech-republic
Why 12-Inch SiC Matters
Moving from 8-inch to 12-inch wafers might sound like a small upgrade, but it’s a revolutionary step in semiconductor manufacturing.
According to Jingsheng, a 12-inch wafer can produce 2.5 times more chips than an 8-inch one. This means:
- Higher productivity per production cycle.
- Lower cost per chip, once mass production begins.
- Cheaper power modules — dropping from $150 to about $90 for automotive-grade units.
That’s a huge cost advantage for downstream sectors such as new energy vehicles, solar power, and 5G communications — all of which rely heavily on power-efficient chips.
Industry analysts estimate that when 12-inch SiC enters volume production, overall wafer costs could fall by up to 40%, making SiC devices more accessible and scalable for global applications.
techovedas.com/china-unveils-top-5-new-12-inch-wafer-production-lines-for-semiconductor-growth
China’s Growing SiC Power
China’s SiC ambitions aren’t new, but 2025 is shaping up to be the year they become reality.
According to TrendForce, China’s share of the global SiC substrate market is expected to jump from 35% in 2024 to 60% in 2025. At the same time, localization of production equipment has surpassed 80%, showing just how rapidly domestic suppliers have closed the technology gap.
In 2024, Wolfspeed still led the market with 34% share, while Chinese players TanKeBlue and SICC each held about 17%. But those numbers are shifting fast.
Chinese companies now have:
- SICC, achieving a 65% yield on its 12-inch SiC line and targeting mass production by the end of 2025.
- TanKeBlue and Infineon, co-developing 12-inch trench-gate SiC MOSFETs for launch in 2026.
- Jingsheng, leading in localized SiC wafer processing.
Together, these efforts are turning China into a self-sustaining SiC powerhouse.
The SiC Boom: Beyond Electric Vehicles
Until recently, SiC’s biggest demand driver was electric mobility. In 2024, new energy vehicles (NEVs) accounted for 73.1% of global SiC device consumption. The material’s high voltage resistance, low energy loss, and excellent heat tolerance make it ideal for EV inverters and fast chargers.
But now, SiC’s potential is expanding.
AI Data Centers as the Next Frontier
AI data centers — powered by massive clusters of GPUs — are pushing energy and cooling systems to their limits. As these centers grow, power conversion efficiency and thermal management become critical bottlenecks.
This is where SiC comes in. With its superior thermal conductivity and high-temperature endurance, SiC can:
- Improve server power efficiency.
- Reduce energy loss during high-load computation.
- Enable compact, high-performance cooling modules for AI chips.
In short, the same material revolutionizing EVs could soon revolutionize AI infrastructure as well.
techovedas.com/5-top-chinas-companies-driving-semiconductor-material-growth-in-2025/
NVIDIA’s SiC Experiment
According to Wealth Magazine, NVIDIA is reportedly planning to replace traditional silicon interposers with silicon carbide in its upcoming Rubin architecture GPUs.
This would be a first for the industry — using SiC not just in power devices, but inside AI chip packaging itself.
Why does this matter?
- Better heat dissipation could allow denser GPU clusters.
- Lower resistance means faster data transmission between chips.
- Higher thermal thresholds enable GPUs to run longer at peak performance.
If successful, NVIDIA’s move could open a new application domain for SiC, turning it into a core material for next-generation AI hardware.
/techovedas.com/nvidias-next-gen-ai-chip-r100-to-use-tsmcs-3nm-process-hvm-by-4q25-with-cowos-l/
Strategic Impact: A New Chapter in Semiconductor Sovereignty
China’s world’s first fully 12-inch SiC line represents more than an engineering win — it’s a strategic milestone.
Here’s why it matters:
- Reduces reliance on foreign equipment suppliers.
- Strengthens domestic innovation in high-end materials.
- Boosts competitiveness in fast-growing global markets like EVs and AI.
- Builds resilience against export restrictions and supply disruptions.
In essence, this marks the beginning of a localized SiC ecosystem, capable of competing head-to-head with global leaders.
Challenges Ahead
Even with this breakthrough, several hurdles remain before full-scale commercialization:
- Yield optimization: 12-inch wafers are more complex and costly to perfect.
- Tool stability and integration: Ensuring seamless equipment interoperability is critical.
- Standardization: Global acceptance of China’s 12-inch SiC specs will determine export potential.
However, with strong government backing and rising global demand for energy-efficient chips, China’s SiC industry appears to be on a fast track to maturity.
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The Bigger Picture
Just a decade ago, China’s semiconductor industry was struggling to catch up. Today, it’s not only closing the gap but setting new benchmarks.
From solar cells to EV batteries and now SiC power chips, China is systematically localizing advanced technologies and scaling them faster than anyone else.
The success of Jingsheng’s 12-inch SiC pilot line could mirror the country’s earlier dominance in photovoltaics — starting local, then scaling global.
As the world races toward electrification and AI, silicon carbide will be the backbone of efficient power management. And with full equipment localization achieved, China is positioned to lead that transformation.
Conclusion
The launch of the world’s first fully localized 12-inch SiC production line is more than a headline — it’s a signal that the next phase of semiconductor innovation is already underway in China.
With 12-inch wafers promising higher yields, lower costs, and broader applications — from electric vehicles to AI supercomputers — this breakthrough positions China not just as a fast follower, but as a front-runner in next-generation chip materials.
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