Global Semiconductor Industry to Invest $400 Billion in 300mm Fab Equipment by 2027

The global semiconductor industry is set to invest $400 billion in 300mm fab equipment by 2027

Introduction

The global semiconductor industry is gearing up for a significant wave of investments. Between 2025 and 2027, the industry is set to allocate $400 billion for 300mm fab equipment.

This surge in spending will power the next generation of semiconductors, fueling advancements in AI, cloud computing, and consumer electronics.

SEMI, a global industry association, represents over 3,000 companies and 1.5 million professionals across the semiconductor and electronics industries. SEMI fosters collaboration, advocacy, and workforce development to support the growth of the semiconductor sector.This $400 billion investment signifies the industry’s commitment to advancing technology and addressing the rising demand for cutting-edge semiconductors.

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Key Highlights

  1. Massive Investment: $400 billion earmarked for 300mm fab equipment from 2025 to 2027.
  2. Record Spending: Investment in 2025 alone expected to reach $123.2 billion, a new high.
  3. Regional Leaders: China, Korea, and Taiwan are set to dominate spending.
  4. Technology Focus: Sub-3nm nodes and memory technologies will be the main targets.
  5. Growth Across Sectors: Foundry, memory, power, and sensors see substantial investment.

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Historic Investment Surge in 2025

In 2025, the semiconductor industry will witness a 24% jump in spending, reaching $123.2 billion.

This marks the first time the industry surpasses the $100 billion threshold for fab equipment in a single year.

The main drivers behind this surge include the need for advanced chips to support AI-driven applications, cloud infrastructure, and consumer electronics.

Continued Growth Through 2026 and 2027

The investment momentum will continue. In 2026, spending is expected to grow by 11%, totaling $136.2 billion.

By 2027, this figure will climb to $140.8 billion, marking a 3% increase. These numbers reflect the industry’s commitment to expanding capacity and staying ahead of rising global demand.

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Regional Investment Breakdown

China Leads the Pack

China is projected to invest over $100 billion in 300mm fab equipment over the next three years. The country’s goal is to become more self-sufficient in semiconductor manufacturing. This move aligns with China’s broader national strategy, especially in light of global supply chain challenges.

Korea: Memory Focus

Korea, known for its leadership in memory technologies, will invest $81 billion between 2025 and 2027.

The country’s focus will be on DRAM and 3D NAND, which are critical for both consumer electronics and enterprise computing.

Taiwan: Leading in Logic

Taiwan is expected to invest $75 billion in cutting-edge fab equipment. TSMC and other companies will focus on sub-3nm nodes to maintain their leadership in advanced logic technology.

Americas: Boosting Domestic Production

The Americas will ramp up investments, allocating $63 billion by 2027.

This surge stems from geopolitical concerns and government incentives that aim to strengthen domestic production capabilities.

Japan, Europe, and Southeast Asia

Other key regions, including Japan, Europe, and Southeast Asia, will also see notable increases in spending.

Japan plans to invest $32 billion, while Europe and the Middle East will contribute $27 billion. Southeast Asia will expect to invest $13 billion, driven by growing demand and government incentives.

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Equipment Spending by Segment

Foundry Takes the Lead

Foundry equipment will dominate, with $230 billion allocated from 2025 to 2027. The focus will be on advanced technologies such as sub-3nm nodes, essential for high-performance computing.

The industry is also advancing technologies like Gate-All-Around (GAA) and backside power delivery at 2nm, which will play a pivotal role in improving both performance and energy efficiency.

Memory Segment Growth

The memory segment will see investments of over $120 billion during this period. DRAM and 3D NAND technologies are essential for AI, cloud, and IoT applications.

DRAM will receive $75 billion in spending, highlighting the critical role memory plays in today’s digital economy.

Power, Analog, and Mixed-Signal Technologies

Investment in power-related equipment is projected to reach $30 billion by 2027. Analog and mixed-signal technologies, crucial for automotive and industrial applications, will see investments totaling $23 billion.

These technologies are essential for ensuring reliable power and signal integrity in a range of industries.

Opto/Sensors Segment

The opto/sensors segment, which enables advanced consumer electronics and autonomous vehicles, will attract $12.8 billion in investments.

This area is key for innovations in sensing technology, which will become even more crucial as industries like autonomous driving and IoT evolve.

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Driving Factors Behind This Growth

The primary driver for this massive investment is the growing demand for semiconductors, particularly for AI, cloud computing, and high-performance computing.

Companies are racing to expand their capacity to meet the needs of an increasingly digital world.

Governments around the world are also providing incentives to boost local manufacturing, further accelerating investment in semiconductor production.

Conclusion: A Record-Setting Period

The next three years will be a transformative period for the semiconductor industry. With $400 billion allocated for 300mm fab equipment, the global semiconductor landscape will evolve rapidly.

This investment will not only enhance production capacity but also push technological boundaries, ensuring the industry continues to be at the forefront of global innovation.

The global semiconductor industry is gearing up for unprecedented growth, driven by innovation and the growing need for advanced semiconductors.

As regions compete to solidify their leadership positions, the next three years will be crucial in shaping the future of technology.

Kumar Priyadarshi
Kumar Priyadarshi

Kumar Joined IISER Pune after qualifying IIT-JEE in 2012. In his 5th year, he travelled to Singapore for his master’s thesis which yielded a Research Paper in ACS Nano. Kumar Joined Global Foundries as a process Engineer in Singapore working at 40 nm Process node. Working as a scientist at IIT Bombay as Senior Scientist, Kumar Led the team which built India’s 1st Memory Chip with Semiconductor Lab (SCL).

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