How Intel & Samsung’s Struggles affect ASML’s Future

Intel and Samsung, two of the world's largest semiconductor manufacturers, are facing significant hurdles in achieving profitability and maintaining technological leadership.

Introduction:

The semiconductor industry in 2024 paints a picture of stark contrasts. While Taiwan Semiconductor Manufacturing Company (TSMC) enjoys a remarkable stock increase of +89%, both Intel and Samsung have seen significant declines, with their stocks falling -58% and -32% respectively. Amid this turmoil, ASML’s Holding, the Dutch powerhouse leading the extreme ultraviolet (EUV) lithography market, remains relatively stable with a modest +1% growth in stock value.

ASML’s unique position as the sole provider of EUV lithography machines makes it indispensable for advancing semiconductor technology. However, the contrasting fortunes of its key customers—Intel, Samsung, and TSMC—pose both opportunities and challenges for its growth trajectory.

1. Intel’s Struggles: A Double-Edged Sword

Intel’s decline stems from its inability to regain its manufacturing edge against competitors like TSMC and Samsung. The company has increasingly outsourced advanced chip manufacturing to TSMC, indirectly driving demand for ASML’s EUV equipment.

However, Intel’s internal investments to build advanced fabs, part of its IDM 2.0 strategy, could mean a more conservative short-term purchasing pattern for ASML machines. This creates a paradox: while Intel’s reliance on TSMC indirectly benefits ASML, its own investments could temporarily reduce its direct orders. The long-term outlook hinges on Intel successfully executing its manufacturing roadmap, particularly its push toward 2nm and 1.8nm nodes, which will require substantial EUV deployment.

$6.6 Billion: Biden Administration Grant to TSMC Under CHIPS Act | by techovedas | Nov, 2024 | Medium

2. Samsung’s Slump: Memory Market Woes

Samsung’s semiconductor division faces challenges, particularly in the memory market, where it has been a dominant player. Weak demand for memory chips and economic headwinds have prompted Samsung to scale back capital expenditures. As a major ASML customer, this pullback could result in delayed purchases of advanced EUV machines, especially for DRAM production at cutting-edge nodes.

Despite these challenges, Samsung remains committed to technological leadership in both logic and memory. Its investments in 3nm GAA (gate-all-around) transistor technology demonstrate its ambition, albeit at a potentially slower pace. For ASML, this means a fluctuating demand curve driven by Samsung’s cautious approach to expansion.

3. TSMC’s Growing Dominance: A Boon and a Risk

TSMC’s dominance in the semiconductor foundry market is both a boon and a risk for ASML. As the leader in advanced nodes, TSMC is one of ASML’s largest customers, driving demand for EUV equipment as it pushes the boundaries of Moore’s Law. TSMC’s move toward 2nm nodes and beyond will necessitate even more advanced lithography tools, including ASML’s next-generation High-NA EUV systems.

However, TSMC’s market dominance also reduces competitive pressure among foundries, potentially limiting the number of buyers for ASML’s cutting-edge machines. If TSMC continues to consolidate its leadership, ASML’s reliance on a single major customer could become a point of vulnerability, especially if TSMC’s capital expenditure fluctuates.

techovedas.com/₹42245-crore-modi-governments-boost-for-electronics-manufacturing-5-stocks-set-to-soar/

4. Broader Semiconductor Industry Slowdown

The broader slowdown in the semiconductor industry, exacerbated by geopolitical tensions, economic uncertainties, and fluctuating consumer demand, presents additional risks for ASML.

While demand for chips powering AI, automotive, and high-performance computing remains robust, segments like smartphones and PCs have seen a decline, impacting overall fab investments.

Opportunities Amidst Challenges

Despite these headwinds, ASML’s position as a critical enabler of semiconductor innovation provides it with unique opportunities:

  • Next-Gen EUV Adoption: The transition to High-NA EUV lithography offers a new revenue stream as fabs gear up for 2nm and smaller nodes.
  • Diverse Applications: The rise of AI chips, advanced sensors, and photonics expands the market for cutting-edge lithography.
  • Global Expansion: Efforts to diversify semiconductor manufacturing geographically, particularly in the US and Europe, could drive new fab investments, benefiting ASML.

https://medium.com/@kumari.sushma661/foxconn-to-establish-second-largest-battery-plant-in-tamil-nadu-a7248e7dafe6

The Strategic Outlook for ASML

ASML’s future depends on balancing its reliance on TSMC with efforts to diversify its customer base. Supporting Intel’s manufacturing resurgence and Samsung’s recovery in the memory market will be key.

Furthermore, ASML must continue innovating to maintain its technological edge, ensuring it remains indispensable as the industry tackles the challenges of advanced node manufacturing.

techovedas.com/saudi-arabia-invests-12–8-billion-to-build-massive-data-center-at-oxagon/

Conclusion:

ASML’s stability in 2024 reflects its unmatched value proposition in the semiconductor supply chain. However, the struggles of Intel and Samsung, coupled with TSMC’s growing dominance, underline the complexities of its growth path. The broader industry slowdown adds another layer of uncertainty.

While ASML’s reliance on TSMC EUV lithography could drive growth in the short term, its long-term prospects hinge on a more balanced customer base and continued innovation.

As the semiconductor industry evolves, ASML’s ability to adapt to shifting market dynamics will determine whether it can sustain its leadership position in the years to come.

The key question remains: Will ASML navigate these challenges to emerge stronger, or will it face a slowdown as its key customers grapple with their own struggles? Only time will tell.

Kumar Priyadarshi
Kumar Priyadarshi

Kumar Joined IISER Pune after qualifying IIT-JEE in 2012. In his 5th year, he travelled to Singapore for his master’s thesis which yielded a Research Paper in ACS Nano. Kumar Joined Global Foundries as a process Engineer in Singapore working at 40 nm Process node. Working as a scientist at IIT Bombay as Senior Scientist, Kumar Led the team which built India’s 1st Memory Chip with Semiconductor Lab (SCL).

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