Huawei’s Ascend 910C AI Chip to Challenge Nvidia with 2025 Mass Production Launch

Introduction

Huawei, one of China’s most prominent technology companies, is set to ramp up production of its newest artificial intelligence (AI) chip, the Huawei’s Ascend 910C, by the first quarter of 2025.

This move comes despite the ongoing challenges imposed by U.S. trade restrictions, which have affected the company’s ability to manufacture chips at scale. The company is determined to challenge the dominance of U.S.-based AI chip manufacturers like Nvidia, even as geopolitical tensions between the U.S. and China over trade and technology intensify.

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Overview of Key Points:

  1. Huawei’s New AI Chip: The Ascend 910C is designed to rival chips from Nvidia and is set for mass production in 2025.
  2. Production Challenges: Due to U.S. export restrictions, Huawei faces difficulties in achieving the high yields necessary for commercial viability.
  3. Dependence on SMIC: The chip is being produced by Semiconductor Manufacturing International Corporation (SMIC) on their N+2 process, but limited access to advanced lithography tools has hindered production.
  4. Impact of U.S. Curbs: The U.S. has restricted the export of advanced semiconductor manufacturing tools, including extreme ultraviolet (EUV) lithography machines, which are vital for high-performance chips.
  5. Geopolitical Tensions: Huawei remains at the center of a broader dispute between the U.S. and China over technology dominance, with both governments taking steps to limit the other’s technological progress.

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Background: Huawei’s AI Ambitions

Huawei plans to mass-produce its advanced AI chip, the Ascend 910C, by early 2025. The chip aims to rival Nvidia’s offerings in the AI and data center markets.

It is a key part of Huawei’s strategy to reduce reliance on foreign technology and strengthen its presence in high-performance computing.

As industries like cloud computing and autonomous vehicles rely on AI, advanced chips become essential. Huawei’s move reflects its determination to compete globally. However, challenges stemming from U.S.-China trade tensions threaten its progress.

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The U.S. Restrictions and Huawei’s Struggles

The U.S. government has placed Huawei on an entity list, blocking access to critical semiconductor technologies.

These restrictions limit Huawei’s ability to source key components and manufacturing tools. The lack of extreme ultraviolet (EUV) lithography machines has hindered its ability to produce advanced chips.

Huawei depends on SMIC, China’s largest chip foundry, for manufacturing. However, SMIC uses older deep ultraviolet (DUV) technology, which is less efficient than EUV systems. This technological gap leads to lower production yields.

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Low Yields Challenge Mass Production

Huawei’s Ascend 910C faces significant hurdles in achieving mass production. Reports show yields of only 20%, far below the industry standard of 70%.

For comparison, its earlier model, the Ascend 910B, achieved a 50% yield but still fell short of commercial expectations.

SMIC’s limited manufacturing capabilities further strain production. Without EUV machines, producing smaller, efficient chips becomes nearly impossible. These challenges force Huawei to delay orders and scale back targets.

SMIC’s Role and Limitations

SMIC plays a crucial role in Huawei’s chip production. However, it faces its own struggles due to U.S. export controls.

The U.S. restricts SMIC from acquiring the latest tools needed for advanced manufacturing.

SMIC relies on enhanced DUV machines but demands higher prices for its chips. These prices are 50% higher than competitors like TSMC, which offer more advanced nodes.

Despite the premium, Huawei must rely on SMIC as it lacks alternatives.

Impact of U.S. Trade Policies

U.S. policies have significantly disrupted Huawei’s supply chain. Export controls prevent Huawei from accessing ASML’s EUV technology. These machines are critical for manufacturing next-generation semiconductors.

The restrictions also target Huawei’s collaborations with suppliers like TSMC. Earlier this year, the U.S. halted TSMC’s shipments of advanced AI chips to Huawei. This has further narrowed Huawei’s options for sourcing advanced components.

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Strategic Push for Self-Sufficiency

Huawei has started shipping samples of the Ascend 910C to technology firms. It has also prioritized government and corporate orders. The company knows it cannot meet large-scale demand without advanced tools.

Beijing supports Huawei’s push for self-reliance in semiconductors. China views this effort as critical for reducing dependency on foreign technology. Huawei’s ambitions align with China’s broader technological independence goals.

The Road Ahead

Huawei’s efforts to produce the Ascend 910C highlight its resilience. The company faces immense pressure from geopolitical tensions and supply chain hurdles. Competing with Nvidia and other global giants remains a tough challenge.

For now, Huawei must balance innovation with production constraints. Its success will depend on navigating these challenges while advancing its technological capabilities.

Conclusion

Huawei’s bold move into AI chips reflects its ambition to lead in the tech race. The Ascend 910C shows promise but faces tough challenges. Low yields, supply chain disruptions, and U.S. restrictions limit progress.

Despite these issues, Huawei remains committed to advancing AI and semiconductor technologies. Its journey toward self-sufficiency will be closely watched as it navigates a highly competitive landscape.

Kumar Priyadarshi
Kumar Priyadarshi

Kumar Priyadarshi is a prominent figure in the world of technology and semiconductors. He is the founder of Techovedas, India’s first semiconductor and AI tech media company, where he shares insights, analysis, and trends related to the semiconductor and AI industries.

Kumar Joined IISER Pune after qualifying IIT-JEE in 2012. In his 5th year, he travelled to Singapore for his master’s thesis which yielded a Research Paper in ACS Nano. Kumar Joined Global Foundries as a process Engineer in Singapore working at 40 nm Process node. Working as a scientist at IIT Bombay as Senior Scientist, Kumar Led the team which built India’s 1st Memory Chip with Semiconductor Lab (SCL).

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