Introduction

Intel is intensifying its foundry battle against TSMC with a bold and detailed roadmap for its next-generation process nodes. The company announced that risk production for its advanced 14A node will begin in 2027, while enhanced variants of the 18A node—named 18A-P and 18A-PT—are set to roll out in 2026 and 2028.

This push marks a significant step in Intel’s strategy to regain leadership in advanced semiconductor manufacturing, especially after falling behind rivals like TSMC and Samsung over the past decade.

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At a Glance: Intel’s Advanced Node Strategy

• 14A node in risk production by 2027: Promises up to 20% performance boost over 18A with reduced power consumption.
• 18A-P and 18A-PT announced: Performance-optimized versions of 18A arriving in 2026 and 2028.
• Foveros Direct 3D bonding debuts on 18A-PT: Intel aims to beat TSMC’s SoIC-X with sub-5 micron pitch.
• PowerDirect replaces PowerVia: Second-gen backside power delivery system improves energy efficiency.
• Foundry ecosystem expands: Intel works closely with customers on Process Design Kits (PDKs) for new nodes.

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Intel’s Foundry Comeback: A Background

Intel’s resurgence in the semiconductor race is part of CEO Pat Gelsinger’s IDM 2.0 strategy, which aims to restore Intel’s chipmaking edge while offering foundry services to external customers. After struggling with delays in its 10nm and 7nm nodes, Intel pivoted in 2021 by setting out a five-node-in-four-years plan. That roadmap includes Intel 7, 4, 3, 20A, and 18A.

The 18A node, short for 18 angstroms (1.8nm), represents a breakthrough with RibbonFET transistors and PowerVia, the first-generation backside power delivery network. Now, Intel plans to take that further with 14A—an even smaller and more efficient node.

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14A Node: Intel’s 2027 Risk Production Target

Intel announced at Intel Foundry Direct Connect 2025 that it has started sharing early Process Design Kits (PDKs) for its 14A process with lead customers. Risk production is set to begin in 2027, according to reports from TechNews and Economic Daily News.

The 14A node will introduce PowerDirect, Intel’s second-generation backside power delivery technology. It improves upon PowerVia by offering better signal integrity and power efficiency. Intel claims that chips built on 14A could deliver 15–20% higher performance and 25–35% lower power consumption compared to 18A.

Backside power delivery, which moves power lines underneath the transistor layer, helps shrink the chip footprint and improve power delivery to transistors. This architectural change allows Intel to achieve higher density and more energy-efficient chips, putting it two generations ahead of TSMC, which is expected to use backside power delivery only after 2028.

18A Variants: Performance-Optimized Nodes in 2026 and 2028

While 18A is already in risk production and expected to enter volume manufacturing by late 2025, Intel also revealed two new derivatives:

• 18A-P: A high-performance version of 18A set to debut in 2026.
• 18A-PT: Another performance-tuned variant arriving in 2028.

Both nodes aim to cater to demanding markets such as artificial intelligence (AI), data centers, and edge computing.

Intel will use 18A for key products like the Panther Lake client processor in H2 2025 and the Clearwater Forest server chip in early 2026. These chips will be Intel’s first to use RibbonFET and PowerVia in high-volume production.

Foveros Direct 3D Bonding: Intel Takes on TSMC’s SoIC-X

The standout feature of 18A-PT is Intel’s Foveros Direct 3D hybrid bonding technology. Unlike traditional chip stacking with bumps or micro-bumps, Foveros Direct allows Intel to vertically bond chiplets using Through-Silicon Vias (TSVs) with pitches smaller than 5 microns.

This technique gives Intel a strong edge against TSMC’s SoIC-X bonding, which currently offers a 9-micron pitch. A smaller pitch enables more compact, lower-latency interconnects between stacked dies—critical for next-gen AI accelerators and advanced processors.

Foveros Direct also reduces resistance and improves signal speed, allowing chipmakers to build faster, more power-efficient systems. It confirmed that the 18A-PT node will support this hybrid bonding and is designed for use in advanced packaging solutions.

 Intel to Start Mass EUV Production in Ireland; 2 Out of 5 nodes achieved

Intel Foundry’s Mature Node Progress and Global Partnerships

While Intel races ahead on advanced nodes, it also strengthens its position in mature process technologies. The company completed its first 16nm tapeout and is co-developing a 12nm node with Taiwan’s UMC (United Microelectronics Corporation).

These mature nodes help attract a broader customer base, especially those building analog chips, display drivers, and connectivity ICs, where cutting-edge geometries are unnecessary.

Intel Foundry Services (IFS) is also building a robust ecosystem of Electronic Design Automation (EDA) and IP partners. By collaborating with companies like Synopsys, Cadence, and Arm, Intel ensures that customers can quickly ramp up chip designs on 18A and future nodes.

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Can Intel Really Challenge TSMC?

Intel’s push comes just after TSMC revealed plans to start volume production of its A14 node (1.4nm) in 2028. However, industry watchers like Wccftech argue that Intel’s early adoption of backside power delivery and 3D hybrid bonding gives it a two-year lead in architectural innovations.

Still, Intel must prove it can deliver on time. The company has faced past challenges in node transitions. If Intel meets its roadmap milestones for 14A and 18A-PT, it could become a serious threat to TSMC in the high-performance computing market.

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Conclusion: Intel’s High-Stakes Comeback Strategy

Intel’s advanced roadmap, featuring 14A in 2027 and enhanced 18A variants in 2026 and 2028, underscores its determination to reclaim its position as a semiconductor leader. Backed by breakthrough technologies like PowerDirect and Foveros Direct, Intel is building the tools it needs to challenge TSMC’s dominance.

With strategic partnerships, mature-node development, and a growing foundry customer base, Intel is not just playing catch-up—it’s aiming to leap ahead. The next three years will be critical to determine if the company can execute on its promises and reshape the global chip industry.

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