Introduction
In a groundbreaking move poised to revolutionize the semiconductor industry, Intel Foundry Services (IFS) and Cadence Design Systems, Inc. have solidified their partnership through a multiyear strategic agreement.
The collaboration aims to assist customers in designing and manufacturing SoC projects more quickly and efficiently on Intel’s 18A process node.
Both companies will collaborate on customized intellectual property (IP), design flows, and design techniques specifically optimized for Intel’s 18A node.
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Empowering Innovation with Advanced Technology
At the heart of this collaboration lies Intel’s 18A technology, featuring RibbonFET gate-all-around transistors and PowerVia backside power delivery.
This innovation lays the groundwork for both companies to develop a range of customized IP, streamlined design flows, and techniques.
The aim? To empower joint customers to expedite their System-on-Chip (SoC) projects across Intel’s advanced nodes. This is propelling innovation in critical sectors such as Artificial Intelligence (AI), High-Performance Computing (HPC), and premium mobile applications.
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A Strategic Leap Forward
Anirudh Devgan, President and CEO of Cadence, underscores the significance of this partnership. This not only cements their collaboration with Intel Foundry Services but also amplifies their commitment to providing cutting-edge design software and leading IP across multiple Intel advanced nodes.
This strategic leap forward aligns seamlessly with Intel’s IDM 2.0 strategy. This is driving towards enhanced customer outcomes and industry-leading advancements in semiconductor technology.
Potential Implications:
Accelerated adoption of Intel’s 18A node: By making chip design easier and faster, this partnership could encourage more companies to adopt Intel’s latest process technology.
Strengthening Intel’s Foundry Services (IFS) offering: This agreement further strengthens Intel’s position as a foundry service provider.
Increased competition in the chip market: By enabling faster and more efficient design, this partnership could potentially lead to increased competition in the chip market, benefiting consumers with more choices and better prices.
Choice and Versatility for Customers
Stuart Pann, Intel’s Senior VP and IFS GM, is thrilled about expanding the partnership with Cadence. He stresses the significance of providing options for customers. Intel aims to enable customers to create high-volume, high-performance, and power-efficient SoCs on its advanced process technologies, leveraging Cadence’s top-tier IP and design solutions.
This partnership enhances the offerings of Intel Foundry Services. This also underscores the commitment to empowering customers with the tools and resources needed to excel in today’s dynamic market landscape.
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Conclusion: Driving Forward, Together
The partnership between IFS and Cadence Design Systems represents a monumental step forward in the realm of semiconductor innovation.