Intel and Cadence Collaborate for Faster Time-to-Market SoC Chips Using 18A Node

This joint effort can potentially lead to faster time-to-market, lower costs, and improved performance for SoC projects.

Introduction

In a groundbreaking move poised to revolutionize the semiconductor industry, Intel Foundry Services (IFS) and Cadence Design Systems, Inc. have solidified their partnership through a multiyear strategic agreement.

The collaboration aims to assist customers in designing and manufacturing SoC projects more quickly and efficiently on Intel’s 18A process node.

Both companies will collaborate on customized intellectual property (IP), design flows, and design techniques specifically optimized for Intel’s 18A node.

Follow us on Linkedin for everything around Semiconductors & AI

Empowering Innovation with Advanced Technology

At the heart of this collaboration lies Intel’s 18A technology, featuring RibbonFET gate-all-around transistors and PowerVia backside power delivery.

This innovation lays the groundwork for both companies to develop a range of customized IP, streamlined design flows, and techniques.

Intel RibbonFET

The aim? To empower joint customers to expedite their System-on-Chip (SoC) projects across Intel’s advanced nodes. This is propelling innovation in critical sectors such as Artificial Intelligence (AI), High-Performance Computing (HPC), and premium mobile applications.

Read More: How NVIDIA GPUs have Evolved From Tesla to Ampere to Hopper – techovedas

A Strategic Leap Forward

Anirudh Devgan, President and CEO of Cadence, underscores the significance of this partnership. This not only cements their collaboration with Intel Foundry Services but also amplifies their commitment to providing cutting-edge design software and leading IP across multiple Intel advanced nodes.

This strategic leap forward aligns seamlessly with Intel’s IDM 2.0 strategy. This is driving towards enhanced customer outcomes and industry-leading advancements in semiconductor technology.

Potential Implications:

Accelerated adoption of Intel’s 18A node: By making chip design easier and faster, this partnership could encourage more companies to adopt Intel’s latest process technology.

Strengthening Intel’s Foundry Services (IFS) offering: This agreement further strengthens Intel’s position as a foundry service provider.

Increased competition in the chip market: By enabling faster and more efficient design, this partnership could potentially lead to increased competition in the chip market, benefiting consumers with more choices and better prices.

Choice and Versatility for Customers

Stuart Pann, Intel’s Senior VP and IFS GM, is thrilled about expanding the partnership with Cadence. He stresses the significance of providing options for customers. Intel aims to enable customers to create high-volume, high-performance, and power-efficient SoCs on its advanced process technologies, leveraging Cadence’s top-tier IP and design solutions.

This partnership enhances the offerings of Intel Foundry Services. This also underscores the commitment to empowering customers with the tools and resources needed to excel in today’s dynamic market landscape.

Read More: 10 Things to Know About OpenAI’s Sora Videos – techovedas

Conclusion: Driving Forward, Together

The partnership between IFS and Cadence Design Systems represents a monumental step forward in the realm of semiconductor innovation.

Kumar Priyadarshi
Kumar Priyadarshi

Kumar Priyadarshi is a prominent figure in the world of technology and semiconductors. With a deep passion for innovation and a keen understanding of the intricacies of the semiconductor industry, Kumar has established himself as a thought leader and expert in the field. He is the founder of Techovedas, India’s first semiconductor and AI tech media company, where he shares insights, analysis, and trends related to the semiconductor and AI industries.

Kumar Joined IISER Pune after qualifying IIT-JEE in 2012. In his 5th year, he travelled to Singapore for his master’s thesis which yielded a Research Paper in ACS Nano. Kumar Joined Global Foundries as a process Engineer in Singapore working at 40 nm Process node. He couldn’t find joy working in the fab and moved to India. Working as a scientist at IIT Bombay as Senior Scientist, Kumar Led the team which built India’s 1st Memory Chip with Semiconductor Lab (SCL)

Articles: 2147