Intel Hits Key Milestones with 18A Chip production, Reinforcing Foundry Leadership and Future Innovation

With the first external customer expected to tape out on Intel 18A in early 2025, Intel Foundry Services is poised to revolutionize the industry with groundbreaking technologies like RibbonFET and PowerVia.

Introduction

Intel has recently announced a significant breakthrough in its semiconductor manufacturing capabilities, achieving major milestones with its advanced Intel 18A Chip Production node.

This development marks a crucial step in Intel’s ambitious journey to regain leadership in the semiconductor industry and expand its foundry business.

The successful powering-on and booting of operating systems by the lead products on Intel 18A, Panther Lake, and Clearwater Forest, showcase Intel’s innovative prowess and commitment to delivering next-generation solutions.

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Intel 18A Chip production: A Leap Forward in Semiconductor Technology

Intel 18A, the company’s most advanced process node, incorporates cutting-edge innovations such as RibbonFET gate-all-around transistors and PowerVia backside power delivery.

These technologies are pivotal in enhancing transistor performance, power efficiency, and overall chip scalability, making Intel 18A a cornerstone in the era of AI computing.

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RibbonFET and PowerVia: Revolutionizing Chip Design

RibbonFET allows tight control over the electrical current in the transistor channel. This enables further miniaturization of chip components. It also reduces power leakage. This is crucial as chip densities increase.

These are gate-all-around transistors that offer several advantages over traditional FinFET transistors:

  • Improved performance: By surrounding the channel with a gate, RibbonFETs can control the flow of electrons more precisely, leading to faster speeds.
  • Lower power consumption: The improved control over electron flow also reduces power leakage.
  • Smaller transistor size: RibbonFETs allow for denser chip layouts, enabling more transistors to be packed into a given area.
Intel RibbonFET

PowerVia optimizes signal routing. It separates power delivery from the front side of the wafer. This reduces resistance and improves power efficiency.

This innovative technology moves power delivery to the backside of the chip, offering several benefits:

  • Reduced power resistance: By separating power and signal lines, PowerVia reduces electrical resistance, improving power efficiency.
  • Improved signal integrity: Separating power and signal lines also helps to reduce interference, enhancing signal quality.
  • Increased chip density: The backside power delivery allows for more efficient use of the chip’s front side for transistors.

Together, these technologies enable substantial gains in computing performance and battery life for future electronic devices.

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Significance of 18A

  • Performance and Power Efficiency: The combination of RibbonFET and PowerVia is expected to deliver a significant boost in performance while reducing power consumption compared to previous generations of chips.
  • Foundry Leadership: Intel’s success with 18A solidifies its position as a leading foundry, attracting customers seeking advanced manufacturing capabilities.
  • Product Roadmap: The 18A process node is crucial for Intel’s product roadmap, with key products like Panther Lake (client processor) and Clearwater Forest (data center) already showing promising results.
  • Industry Impact: The availability of advanced manufacturing processes like 18A can accelerate innovation across various industries, driving advancements in computing, AI, and other technology sectors.

Panther Lake and Clearwater Forest: Leading the Charge

Panther Lake and Clearwater Forest are the first products to leverage Intel 18A. These chips have successfully powered on and booted operating systems, demonstrating the robustness and readiness of the new process node.

Panther Lake is designed as an AI PC client processor, while Clearwater Forest is a server processor aimed at high-performance computing and AI workloads.

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Key Milestones Achieved

Tape-Out to Power-On: Both Panther Lake and Clearwater Forest achieved tape-out, the final design completion, and powered on within two quarters. This rapid progression underscores Intel’s efficient development processes and technical capabilities.

DDR Memory Performance: Panther Lake’s DDR memory performance is already running at target frequency, indicating the health and stability of Intel 18A.

External Foundry Customer: Intel revealed that its first external foundry customer is expected to tape out on the 18A node in the first half of 2025. This milestone is critical for Intel’s growing foundry business, showcasing its ability to attract and serve external clients.

Panther Lake: The Next-Gen Client Processor

  • Target market: Primarily aimed at the PC market, Panther Lake is designed to power high-performance laptops and desktops.
  • Key features: Expected to incorporate advanced AI capabilities, improved performance, and enhanced power efficiency due to the 18A process.
  • Competition: Will directly compete with AMD’s Ryzen and potentially future offerings from Apple and Qualcomm.

Clearwater Forest: Powering the Data Center

  • Target market: Designed for data center and cloud computing workloads, Clearwater Forest is positioned to compete with AMD’s EPYC and NVIDIA’s data center CPUs.
  • Key features: Expected to deliver significant performance gains, improved power efficiency, and enhanced AI acceleration capabilities.
  • Importance: Crucial for Intel to regain market share in the data center segment.

Significance of Both Products

  • 18A Process Validation: Both Panther Lake and Clearwater Forest serve as testbeds for Intel’s 18A process, demonstrating its maturity and capabilities.
  • Performance Leadership: Successful launch of these products could position Intel as a performance leader in both client and data center markets.
  • Foundry Attraction: The success of these chips will strengthen Intel’s position as a foundry, attracting more customers to its advanced manufacturing processes.

Intel’s Foundry Ambitions

Intel’s foundry services are set to play a pivotal role in its strategy to regain semiconductor leadership.

The company’s systems foundry approach aims to deliver a full stack of innovation. This is essential for next-generation products for both Intel and its foundry customers. This includes pioneering multiple systems foundry technologies tailored for the AI era.

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Customer and Partner Involvement

Intel’s success with the 18A chip production node stems from collaboration with key partners. In July, Intel released the 18A Process Design Kit (PDK) 1.0.

This provided design tools for foundry customers. These tools enable the use of RibbonFET and PowerVia in their designs.

Partners like Cadence and Synopsys are updating their offerings. This support helps customers in their final production designs on Intel 18A.

Cadence: “Cadence’s strategic collaboration with Intel Foundry helps accelerate our mutual customers’ innovation by providing access to industry-leading EDA solutions and IP optimized for Intel 18A,” said Tom Beckley, senior vice president and general manager, Custom IC & PCB Group at Cadence.

Synopsys: “With 18A now customer-ready, Intel Foundry is bringing together the necessary components needed to design next-generation AI solutions that our mutual customers require and expect,” stated Shankar Krishnamoorthy, general manager of the EDA Group at Synopsys.

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Conclusion: Intel’s Path to Semiconductor Leadership

Intel’s achievements with the 18A chip production node underscore its commitment to innovation and leadership in the semiconductor industry.

These milestones with Panther Lake and Clearwater Forest showcase Intel’s technical prowess. They also set the stage for a new era in semiconductor manufacturing.

Intel’s collaboration with partners and customers looks promising for its foundry business. The company’s strategic investments in process technology position it to regain leadership in semiconductor manufacturing.

These advancements will drive the next wave of technological innovation.

Kumar Priyadarshi
Kumar Priyadarshi

Kumar Priyadarshi is a prominent figure in the world of technology and semiconductors. With a deep passion for innovation and a keen understanding of the intricacies of the semiconductor industry, Kumar has established himself as a thought leader and expert in the field. He is the founder of Techovedas, India’s first semiconductor and AI tech media company, where he shares insights, analysis, and trends related to the semiconductor and AI industries.

Kumar Joined IISER Pune after qualifying IIT-JEE in 2012. In his 5th year, he travelled to Singapore for his master’s thesis which yielded a Research Paper in ACS Nano. Kumar Joined Global Foundries as a process Engineer in Singapore working at 40 nm Process node. He couldn’t find joy working in the fab and moved to India. Working as a scientist at IIT Bombay as Senior Scientist, Kumar Led the team which built India’s 1st Memory Chip with Semiconductor Lab (SCL)

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