Intel Next-Gen CPU Tiles Manufactured by TSMC N3B Process: CEO

Gelsinger revealed Intel's decision to enlist TSMC's expertise in producing CPU Tiles for its forthcoming next-generation platforms, Arrow Lake and Lunar Lake, slated for a 2024 launch.

Introduction:

Semiconductor industry is undergoing a seismic shift as Intel CEO announced a substantial expansion of orders to TSMC.

This move represents a strategic pivot for Intel, signaling its determination to regain competitiveness in a rapidly evolving tech landscape. Let’s delve deeper into the intricacies of this strategic shift and its implications for the future of semiconductor manufacturing.

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Expanding Orders deom Intel to TSMC:

At the IFS Direct Connect event, Gelsinger, Intel CEO, revealed Intel’s decision to enlist TSMC’s expertise in producing CPU Tiles for its forthcoming next-generation platforms, Arrow Lake and Lunar Lake, slated for a 2024 launch. Arrow Lake and Lunar Lake are the codenames for Intel’s upcoming 15th and 16th generation of Core processors, respectively

This departure from Intel’s traditional in-house manufacturing underscores the company’s willingness to collaborate with erstwhile competitors for mutual advancement. Utilizing TSMC’s cutting-edge N3B process marks a significant step towards ensuring Intel’s product lineup remains competitive in terms of performance, power efficiency, and manufacturing prowess.

Read More: Intel Mobile Chips to Use 2 nm node from TSMC by 2026: Report

Intel’s Vision for 2030:

Gelsinger unveiled Intel’s ambitious vision to become the world’s second-largest wafer foundry by 2030, leveraging TSMC’s manufacturing capabilities. This goal involves filling the foundry with products spanning two generations of CPU Tiles.

Additionally, Intel aims to extend its services globally. This includes providing process nodes to competitors like NVIDIA and AMD, thereby fostering a more diverse customer base and solidifying its position in the semiconductor industry.

Read More: Why Does Intel Plan to Manufacture Chips for Other Foundries As Per CEO

Geopolitical Considerations:

Amidst the praise for TSMC’s capabilities, Gelsinger sounded a note of caution regarding the geopolitical risks inherent in Taiwan’s location. Intel restated its dedication to ensuring stability and security in chip production, emphasizing the importance of meeting customer demands for safety and reliability.

This acknowledgment underscores the delicate balance between leveraging external expertise and managing geopolitical uncertainties in today’s interconnected world.

Competitive Landscape of Intel Vs TSMC:

The semiconductor industry is witnessing heightened competition, with TSMC and Intel vying for supremacy. TSMC President’s assertion regarding the performance parity of TSMC’s N3P process with competitors’ 18A process underscores the intensity of the rivalry.

Against this backdrop, Intel’s historical dominance in mainstream CPUs positions it as a formidable contender in the race for technological superiority.

Read More: Why Intel is Not Considering to Build a Fab in India

Conclusion:

Intel’s strategic shift towards embracing TSMC and fostering collaborations with competitors marks a watershed moment in semiconductor manufacturing. Gelsinger’s vision for Intel’s future as a leading wafer foundry reflects the company’s adaptability and commitment to innovation.

Kumar Priyadarshi
Kumar Priyadarshi

Kumar Priyadarshi is a prominent figure in the world of technology and semiconductors. With a deep passion for innovation and a keen understanding of the intricacies of the semiconductor industry, Kumar has established himself as a thought leader and expert in the field. He is the founder of Techovedas, India’s first semiconductor and AI tech media company, where he shares insights, analysis, and trends related to the semiconductor and AI industries.

Kumar Joined IISER Pune after qualifying IIT-JEE in 2012. In his 5th year, he travelled to Singapore for his master’s thesis which yielded a Research Paper in ACS Nano. Kumar Joined Global Foundries as a process Engineer in Singapore working at 40 nm Process node. He couldn’t find joy working in the fab and moved to India. Working as a scientist at IIT Bombay as Senior Scientist, Kumar Led the team which built India’s 1st Memory Chip with Semiconductor Lab (SCL)

Articles: 2325