Intel to Start Mass EUV Production in Ireland; 2 Out of 5 nodes achieved

A significant advancement with Intel 4 is its utilization of extreme ultraviolet lithography (EUV), a first for Intel's fabrication processes. EUV integration enhances yield and allows for efficient area scaling, optimizing power efficiency. Intel 4 boasts twice the area scaling for high-performance logic libraries when compared to Intel 7.
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Introduction:

In a significant stride for the semiconductor industry, Intel has announced its initiation of high-volume production utilizing Extreme Ultraviolet (EUV) lithography in Ireland using intel 4. This move marks a substantial leap forward for Intel and the European semiconductor sector, underscoring the company’s dedication to the region.

The Fab 34 facility in Leixlip, Ireland, will be at the forefront, setting the stage for Europe’s first high-volume EUV lithography implementation. This development is instrumental in the manufacturing of Intel 4 chips, the forthcoming generation of chips promising enhanced performance and smaller feature sizes, set to revolutionize a multitude of devices, from smartphones and laptops to servers and data centers.

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Intel EUV Lithography: A Game-Changing Technology

Extreme Ultraviolet (EUV) lithography stands as a fundamental technology pivotal in the production of the most advanced and intricate semiconductor chips. Utilizing a shorter wavelength of light, EUV lithography enables the creation of smaller and more densely packed features on silicon wafers, resulting in highly efficient and powerful chips.

Read More: What is EUV that made ASML the biggest company of Europe

EUV is A Milestone in European Semiconductor Industry by Intel

Intel’s decision to begin high-volume EUV production in Ireland demonstrates its commitment to the European semiconductor industry. The Fab 34 facility in Leixlip will lead Europe in implementing EUV lithography on an industrial scale, marking a significant milestone for the continent’s semiconductor sector.

Intel Manufacturing Global Expansion

Notably, Intel will operate Intel 7 in Israel and Intel 4 in Ireland, highlighting the international scale of their operations.

Intel 3 and 20A will have their base in Arizona, emphasizing their significance in Intel’s future plans. In Europe, Intel may position 18A in Magdeburg or Ireland, showcasing Intel’s global commitment to innovation.

Lastly, “Intel Next” is set to impact Ohio, reinforcing Intel’s widespread node deployment strategy.

This nomenclature, potentially misleading, arises from a comparison of transistor density.

Intel 7, despite being at 10nm, equals TSMC’s 7nm in transistor density. Intel 4 is anticipated to surpass TSMC’s 5nm N5 density, as indicated by WikiChip.

Subsequently, the 18A process will further refine the technology to 1.8nm, continuing the incorporation of PowerVia and RibbonFET advancements.

The presented Intel roadmap chart visualizes this evolution.

NodeLocation
Intel 7Israel
Intel 4Ireland
Intel 3Arizona, USA
Intel 20AArizona, USA
Intel 18AEurope (Madgeburg, Ireland)
Intel NextOhio
Source: Intel innovation day Speech.

Unveiling Intel 4: Redefining Semiconductor Capabilities using EUV

Intel 4, Intel’s upcoming manufacturing process, will redefine semiconductor capabilities, enabling the production of chips with smaller features and enhanced performance. These chips will find applications in smartphones, laptops, servers, and data centers, heralding a new era of technological advancement.

Intel 4 is on the horizon for most users and already a reality for laptop users. Meteor Lake, Intel’s upcoming CPU series, will be manufactured using Intel 4, although with a twist. Meteor Lake’s CPUs will have a compute Tile made with Intel 4 and a graphics Tile made with TSMC’s N3 process. Intel’s Foveros 3D packaging technology will integrate these alongside the SoC and I/O Tiles. This manufacturing approach, known as disaggregation, aligns with AMD’s chiplet strategy.

A significant advancement with Intel 4 is its utilization of extreme ultraviolet lithography (EUV), a first for Intel’s fabrication processes. EUV integration enhances yield and allows for efficient area scaling, optimizing power efficiency. Intel 4 boasts twice the area scaling for high-performance logic libraries when compared to Intel 7.

In relative terms, Intel 4 is referred to as a 7nm process. This aligns with industry counterparts’ 5nm and 4nm processes, highlighting Intel’s prowess in the semiconductor arena.

Implications for the Global Consumer Market

The initiation of high-volume EUV production in Ireland heralds a promising outlook for consumers and businesses worldwide. The enhanced production capacity allows Intel to manufacture more advanced chips at scale. Consequently, this will lead to the creation of faster, more efficient, and high-performing devices, ultimately enhancing the overall user experience across the globe.

Image Credits: Intel

Intel’s Commitment: A Positive Signal for European Competitiveness

Intel’s initiation of high-volume EUV production in Ireland demonstrates commitment to European investment.

It also highlights Europe’s competitive edge in semiconductor manufacturing.

This choice reinforces Intel’s acknowledgment of Europe’s potential, bolstering its standing in the global semiconductor landscape.

Conclusion

IIntel initiating high-volume EUV production at Fab 34 in Ireland signifies a major leap in semiconductor manufacturing. The integration of EUV lithography and the upcoming Intel 4 chips are poised to revolutionize technology, offering faster and efficient devices globally. This move also showcases Intel’s confidence in Europe’s semiconductor industry, setting the stage for collaborative growth and global innovation.

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