Introduction:
Everyone is talking about Intel’s shifting from its 18A to 14A chip process. But let’s be honest—that’s not the real issue.
Intel’s current problems go way back. As someone who has followed the chip industry closely for years, we can tell you that these challenges began more than a decade ago. What we’re seeing now is just the result of years of wrong moves.
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Background: Intel’s Rise and Early Lead
Intel dominated the semiconductor industry for decades. In the 2000s, its process node roadmap set the pace.
The company introduced 65nm in 2006 and 45nm in 2007. For a while, no one could match Intel’s manufacturing skill. Its chips powered PCs, servers, and data centers worldwide.
However, around 2014, rivals like TSMC and Samsung began challenging Intel’s lead. TSMC moved swiftly to 16nm, then 10nm, while Intel stumbled.
That stumble set off a chain of events that still shapes the market today.
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Quick Overview: Intel’s 5 Key Problems
Late to new chip nodes — Intel’s 10nm delay gave rivals like TSMC a huge lead.
Not customer-friendly — Intel made chips for itself, not for clients.
Weak packaging tech — TSMC’s CoWoS is way ahead of Intel’s EMIB or Foveros.
Slow, heavy culture — Big company mindset slowed innovation.
Strategy kept changing — 4 CEOs in 10 years means no stable plan.
Intel to Start Mass EUV Production in Ireland; 2 Out of 5 nodes achieved
Process Delays: The 10nm Disaster
Intel promised its 10nm chips in 2016. They finally arrived in 2019—but only in small numbers. TSMC, meanwhile, jumped to 7nm and then 5nm during that time.
What it meant: Intel lost its leadership. Big tech companies like Apple, AMD, and NVIDIA moved their chip orders to TSMC.
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2. Not a Real Foundry Player
TSMC and Samsung built their success by serving others. Intel, on the other hand, mostly built chips for its own CPUs.
When it launched Intel Foundry Services (IFS) in 2021, it lacked the software tools, customer support, and flexibility that clients expect.
Result: Few external customers signed up.
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3.Packaging Tech Lagged Behind
Advanced packaging matters for AI chips and chiplets. TSMC leads here with CoWoS and InFO, used by NVIDIA and Apple.
Intel’s EMIB and Foveros sound good on paper but haven’t scaled, while TSMC now has 10x more capacity for high-end packaging.
| Tech | Intel | TSMC |
|---|---|---|
| CoWoS/InFO | ❌ | ✅ |
| AI chip support | Limited | Industry-leading |
| Volume clients | Few | Apple, AMD, NVIDIA |
4. Intel’s Culture Problem
Intel still has great engineers. But insiders say the company became too slow and political. Decisions got stuck.
Innovation stalled. Many top engineers left for startups or rivals. Intel lost its “move fast” spirit.
/techovedas.com/intel-accelerates-foundry-plans-18a-chips-in-2026-14a-node-targets-2027/
5. No Clear Strategy: Too Many CEOs
From 2013 to 2025, Intel had four different CEOs. Each brought a different plan. Some focused on PC chips, some on foundry services, others on AI.
This confusion changed roadmaps and reshuffled teams. Customers didn’t know Intel’s true direction.
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Conclusion : It’s About Trust, Not Just Tech
Intel’s challenge isn’t just catching up on nodes. It’s rebuilding trust with clients. TSMC earned that trust by delivering on time, every time.
Intel needs to prove it can do the same—and fast.
The new 14A process may be Intel’s last real shot to show it can deliver at scale for customers, not just itself.
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