Double the Speed, Half the Size: JEDEC Announces MRDIMM and LPDDR6 Standards to Drive Next-Gen AI

JEDEC has announced new DDR5 MRDIMM and LPDDR6 CAMM standards, set to revolutionize memory technology for high-performance computing and AI.

Introduction

JEDEC Solid State Technology Association, the foremost authority on microelectronics standards, has made a landmark announcement in the world of memory technology. The organization is introducing new standards for DDR5 MRDIMM (Multiplexed Rank Dual Inline Memory Modules) and a next-generation Compression-Attached Memory Module (CAMM) for LPDDR6.

These innovations are set to redefine the capabilities of high-performance computing and artificial intelligence (AI), paving the way for the next era of technological advancements.

JEDEC is the leading global organization in microelectronics standards development. With over 350 member companies and more than 100 committees, JEDEC sets widely accepted standards that support the needs of manufacturers and consumers worldwide.

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DDR5 MRDIMM (Multiplexed Rank DIMM):

  • Designed for servers, MRDIMM aims to double the peak bandwidth of traditional DDR5 RDIMMs by increasing pin speed and supporting more than two ranks.
  • Offers backward compatibility with RDIMMs, providing flexibility for system configurations.
  • Expected to accelerate data-intensive workloads, such as AI training and inference.

LPDDR6 CAMM (Compact Memory Module):

  • Targets mobile and embedded devices, offering higher speeds and lower power consumption compared to previous generations.
  • Provides a smaller form factor, enabling more compact device designs.
  • Expected to enhance the performance of smartphones, tablets, and other mobile devices.

Introducing DDR5 MRDIMM: Enhanced Bandwidth and Efficiency

JEDEC’s DDR5 MRDIMM standard marks a significant advancement in memory module design. This cutting-edge technology enhances data transfer rates and overall system performance through multiplexing.

Multiplexing combines multiple data signals and transmits them over a single channel. This innovation effectively increases bandwidth without necessitating additional physical connections, providing a seamless upgrade from DDR5 RDIMM data rates.

Key Features of DDR5 MRDIMM:

Increased Bandwidth: DDR5 MRDIMM delivers up to twice the peak bandwidth of native DRAM, achieving speeds of 12.8 Gbps.This advancement will enable applications to exceed current data rates and achieve new performance benchmarks.

Platform Compatibility: The standard ensures compatibility with existing RDIMM systems by incorporating standard DDR5 DIMM components. These include DRAM, DIMM Form Factor & Pinout, SPD, PMIC, and TS. This ensures an easy transition and broad adoption.

Efficient I/O Scaling: MRDIMM utilizes RCD/DB logic process capabilities for efficient scaling of I/O operations.

Extended Compatibility: The standard supports multi-generational scaling to DDR5-EOL and benefits from the existing LRDIMM ecosystem for design and testing.

Additionally, JEDEC is developing a Tall MRDIMM form factor to offer even greater bandwidth and capacity without modifying the DRAM package. This taller design will enable the mounting of twice the number of DRAM single-die packages on the DIMM, eliminating the need for 3DS packaging.

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Advancements with LPDDR6 CAMM: Higher Speed and Capacity

In a follow-up to JEDEC’s JESD318 CAMM2 Memory Module standard, the JC-45 Committee is working on a next-generation CAMM module for LPDDR6.

This new standard aims to achieve memory speeds exceeding 14.4 GT/s, meeting the escalating demands of high-performance computing and AI.

Key Features of LPDDR6 CAMM:

  • High-Speed Performance: The CAMM module for LPDDR6 is designed to deliver speeds greater than 14.4 GT/s, addressing the high-performance requirements of future technologies.
  • Advanced Configuration: It will feature a 24-bit subchannel and a 48-bit channel, along with a new connector array to enhance connectivity and performance.

Both the DDR5 MRDIMM and LPDDR6 CAMM standards are being developed under the JEDEC JC-45 Committee for DRAM Modules.

JEDEC encourages industry stakeholders to participate in the development process. Membership provides access to pre-publication proposals and insights into ongoing projects, including MRDIMM.

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Impact on Computing and AI

These advancements are poised to drive significant improvements in various computing and AI applications:

  • Data Centers: MRDIMM will enable faster data processing and transfer, accelerating AI training and inference, high-performance computing, and cloud workloads.
  • Mobile Devices: LPDDR6 CAMM will enhance the performance of mobile devices, enabling smoother multitasking, faster app launches, and improved gaming experiences.
  • AI and Machine Learning: Both standards will contribute to faster AI model training and inference, leading to advancements in various AI applications, including natural language processing, image recognition, and autonomous systems.

Overall, JEDEC’s DDR5 MRDIMM and LPDDR6 CAMM standards represent a promising step towards unlocking the full potential of computing and AI technologies.

Looking Ahead

JEDEC’s new standards will transform the memory industry. The DDR5 MRDIMM and LPDDR6 CAMM will boost bandwidth, speed, and capacity.

They are designed to meet the growing demands of high-performance computing and AI. These innovations will support future technological advancements with cutting-edge memory solutions.

As technology evolves, JEDEC’s standards will shape the future of memory technology. Companies and stakeholders should engage with JEDEC to contribute to these developments and stay ahead in the industry.

Conclusion

We are on the edge of a new era in memory technology. JEDEC’s advancements with DDR5 MRDIMM and LPDDR6 CAMM mark a major leap forward.

These innovations will enhance current computing capabilities. They will also set the stage for future breakthroughs in AI and high-performance applications.

Adopting these new standards will boost performance and efficiency. This progress will drive technological advancements and encourage greater innovation.

Kumar Priyadarshi
Kumar Priyadarshi

Kumar Priyadarshi is a prominent figure in the world of technology and semiconductors. With a deep passion for innovation and a keen understanding of the intricacies of the semiconductor industry, Kumar has established himself as a thought leader and expert in the field. He is the founder of Techovedas, India’s first semiconductor and AI tech media company, where he shares insights, analysis, and trends related to the semiconductor and AI industries.

Kumar Joined IISER Pune after qualifying IIT-JEE in 2012. In his 5th year, he travelled to Singapore for his master’s thesis which yielded a Research Paper in ACS Nano. Kumar Joined Global Foundries as a process Engineer in Singapore working at 40 nm Process node. He couldn’t find joy working in the fab and moved to India. Working as a scientist at IIT Bombay as Senior Scientist, Kumar Led the team which built India’s 1st Memory Chip with Semiconductor Lab (SCL)

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