Introduction
In the fast-evolving semiconductor industry, Samsung Electronics and SK Hynix are charting distinctly different strategies in leveraging extreme ultraviolet (EUV) lithography technology. While Samsung focuses on immediate improvements in production yield rates, SK Hynix is placing its bets on long-term technological advancements. These approaches underscore their unique visions to maintain competitiveness in a sector where precision and innovation are critical.
Overview: Key Points at a Glance
- Samsung prioritizes yield improvement: The company has formed a specialized task force to enhance EUV manufacturing efficiency.
- SK Hynix focuses on future innovations: It integrates its EUV team into its Future Technology Research Institute to prepare for next-generation tools.
- EUV technology is pivotal: Both firms utilize ASML’s state-of-the-art machines, valued at over $200 million each, for fine semiconductor circuit production.
- Distinct strategic timelines: Samsung invests in short-term productivity; SK Hynix aims to lead in the long-term innovation race.
- High-NA EUV machines on the horizon: SK Hynix is poised to receive high-NA EUV equipment by late next year, advancing its technological edge.
Samsung: Driving Efficiency and Yield Optimization
Samsung Electronics has demonstrated its commitment to EUV technology by forming the “EUV Synergy TF” under its Global Manufacturing & Infrastructure General Division. This dedicated task force is tasked with streamlining the manufacturing processes for ultra-fine semiconductors, such as its 3-nanometer (nm) foundries.
Key objectives of the EUV Synergy TF include:
- Managing and optimizing EUV equipment performance.
- Enhancing the productivity of lithography and track equipment.
- Maximizing output from ASML’s EUV lithography machines and Tokyo Electron’s EUV track equipment.
Samsung has already invested in over 30 EUV lithography machines, installed across its Hwaseong and Pyeongtaek facilities. The introduction of EUV technology into its production line in 2019 marked a significant milestone, enabling advanced node processes like sub-3 nm foundries. However, improving yield rates for its 10-nm class DRAM and advanced foundries has remained a challenge.
With this new task force, Samsung is focused on addressing these yield challenges while maintaining its competitive edge in the global foundry market.
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SK Hynix: Focusing on the Future
Unlike Samsung, SK Hynix has chosen a longer-term approach. The company recently disbanded its EUV-specific task force, integrating its team into the Future Technology Research Institute. This strategic restructuring highlights SK Hynix’s focus on future technologies rather than immediate yield improvements.
SK Hynix first adopted EUV lithography for its 10-nm class 4th generation DRAM in 2021 and currently operates over 10 EUV machines at its M16 plant in Icheon. However, the company is already looking ahead to the next frontier: high-NA (numerical aperture) EUV lithography equipment.
The Future Technology Research Institute is actively preparing for this transition. SK Hynix is expected to receive its first high-NA EUV machine by the second half of 2025. These machines promise even greater precision, enabling the production of smaller, denser circuits—a necessity for future semiconductor nodes.
The Role of EUV Technology
EUV lithography is critical for advanced semiconductor manufacturing. Using light with a wavelength of 13.5 nm, EUV enables the production of smaller, more intricate circuits on silicon wafers. It has become a key driver for:
- DRAM production: High-density memory chips with improved performance.
- Foundries: Manufacturing cutting-edge processors and system-on-chips (SoCs).
ASML, the sole supplier of EUV lithography machines, plays a central role in the industry. Each machine costs over $200 million, making their utilization critical for cost-effective manufacturing.
High-NA EUV: A New Horizon
High-NA EUV machines, the next evolution of EUV technology, feature larger lenses and higher resolution, pushing the boundaries of semiconductor manufacturing. Samsung and SK Hynix are among the few companies preparing for this leap.
- Samsung’s Strategy: Expected to integrate high-NA machines into its existing infrastructure, aiming to tackle yield challenges.
- SK Hynix’s Vision: Focused on early adoption to lead innovation in memory and advanced node processes.
Competitive Implications
The contrasting strategies of Samsung and SK Hynix reflect broader industry dynamics:
- Samsung’s focus on short-term efficiency helps it maintain its position in the foundry and DRAM markets.
- SK Hynix’s long-term vision positions it to potentially leapfrog competitors in future technology adoption.
These paths highlight the delicate balance between immediate operational needs and long-term innovation in the semiconductor industry.
Conclusion
Samsung and SK Hynix are navigating the complexities of EUV lithography with distinct strategies, each tailored to their strengths and market ambitions. While Samsung focuses on boosting yield rates through targeted efforts,SK Hynix prepares for a future shaped by high-NA EUV equipment. Their choices will not only define their competitive standing but also influence the trajectory of the global semiconductor industry.
By optimizing their approaches, both companies aim to reinforce South Korea’s leadership in the global semiconductor landscape.
