Samsung Electro-Mechanics and AMD Collaborate on Advanced Substrates for Hyperscale Computing

Samsung and AMD have teamed up to provide next-generation data center CPUs and GPUs with cutting-edge high-performance substrates.

Introduction

Samsung Electro-Mechanics (SEMCO) has teamed up with AMD to deliver high-performance substrates for hyperscale data center computing.

This partnership combines Samsung’s advanced substrate technology with AMD’s expertise in high-performance computing.

The goal is to enhance next-generation data center CPUs and GPUs. As demand for efficient data center solutions grows, this alliance will drive innovation.

It aims to set new standards in computing performance and reliability. The new substrates will address the evolving needs of hyperscale data centers.

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Key Details of the Partnership

Collaboration: Samsung Electro-Mechanics (SEMCO) has partnered with AMD to supply high-performance substrates for hyperscale data center computing.

Substrate Focus: These substrates are crucial components for enhancing the performance and reliability of next-generation data centers.

Manufacturing Locations: SEMCO will produce these substrates at its Busan technology hub and the newly built state-of-the-art factory in Vietnam.

Market Growth: The semiconductor substrate market is expected to grow significantly, reaching 20 trillion KRW by 2028.

Benefits: The partnership aims to address the increasing demands of data centers and other compute-intensive applications, such as AI and automotive systems.

Substrate Technology: The focus is on Flip Chip Ball Grid Array (FCBGA) substrates, known for their larger surface areas and higher layer counts, enabling better efficiency and lower energy consumption.

Implications:

Samsung’s new deal with AMD will focus on providing high-performance substrates critical for data center operations.

These substrates will support AMD’s next-generation data center CPUs and GPUs, crucial for managing large-scale computing and AI workloads.

The collaboration highlights SEMCO’s substantial investment in its FCBGA (Fine-Pitch Ball Grid Array) factory.

With an impressive investment of 1.9 trillion KRW, SEMCO plans to advance substrate technology and manufacturing capabilities.

This investment underscores Samsung’s commitment to enhancing its production capabilities to meet the high standards required by future technologies.

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Importance of High-Performance Substrates

High-performance substrates are vital for data centers. They support the integration of multiple semiconductor chips.

These chips, known as chiplets, are placed on a single large substrate. This integration improves performance and efficiency.

It also reduces power consumption. High-performance substrates enhance data transfer speeds. They ensure reliable connections between chiplets.

This is crucial for handling large data volumes. The technology supports advanced computing tasks.

It is essential for modern data center operations. These advanced substrates feature larger surface areas and higher layer counts compared to standard computer substrates.

In data center environments, substrates are approximately ten times larger and feature three times more layers than their standard counterparts.

This design ensures efficient power delivery and maintains signal integrity between chips. SEMCO’s innovative manufacturing processes address potential issues like warpage, which can affect chip mounting and overall yield.

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Impact on AMD’s Product Line and Market Trends

This strategic partnership will significantly impact AMD’s product offerings and market position. AMD’s Instinct AI accelerators, essential for AI industry applications, will benefit from SEMCO’s high-performance substrates.

These accelerators are built to deliver high performance and efficiency, crucial for demanding AI and data center tasks.tasks.

Market research firm Prismark forecasts that the semiconductor substrate market will experience a steady growth rate of around 7% annually, rising from 15.2 trillion KRW in 2024 to 20 trillion KRW by 2028.

This growth reflects the increasing demand for advanced substrate technologies in various high-performance computing applications.

Statements from Key Executives

Kim Wontaek, Executive Vice President of the Strategic Marketing Center at Samsung Electro-Mechanics, expressed enthusiasm about the partnership:

“We are honored to partner with AMD, a global leader in high-performance computing and AI semiconductor solutions.”.

Our continued investment in advanced substrate solutions will provide key value to customers like AMD, addressing the evolving demands of data centers and other compute-intensive applications ranging from AI to automotive systems.”

Scott Aylor, Corporate Vice President of Global Operation Manufacturing Strategy at AMD, emphasized the importance of this collaboration:

At AMD, we are always pushing the edge of innovation to meet the performance and efficiency needs of our customers. Our leadership in chiplet technologies has enabled AMD to deliver leadership performance, efficiency, and flexibility across our CPU and data center GPU portfolio. Continued investments with partners such as SEMCO highlight the work we are doing to ensure we have the advanced substrate technologies and capacity we need to deliver future generations of high-performance computing and AI products.”

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Advanced Manufacturing Capabilities

SEMCO’s FCBGA factory is equipped with state-of-the-art facilities that include real-time data collection and modeling capabilities.

This advanced technology allows SEMCO to develop predictive manufacturing models, ensuring the integrity of signal, power, and mechanical components.

The factory’s ability to produce embedded substrates with both passive (capacitor and inductor) and active (integrated circuit) components positions SEMCO as a leader in the production of next-generation data center substrates.

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This will lead to:

Enhanced Data Center Performance: This collaboration is expected to lead to more efficient and powerful data centers capable of handling the growing demands of AI, cloud computing, and other data-intensive applications.

Market Growth: The increasing demand for advanced substrates will drive growth in the semiconductor industry.

Technological Advancements: Both companies are likely to invest in further research and development to stay ahead in substrate technology.

Conclusion

The collaboration between Samsung Electro-Mechanics and AMD represents a significant advancement in the semiconductor industry, particularly for data center applications.

By leveraging SEMCO’s high-performance substrates, AMD aims to enhance its data center CPUs and GPUs, driving forward the capabilities of high-performance computing and AI technologies.

As the semiconductor substrate market continues to grow, this partnership will play a key role in shaping the future of data center infrastructure.

Kumar Priyadarshi
Kumar Priyadarshi

Kumar Priyadarshi is a prominent figure in the world of technology and semiconductors. With a deep passion for innovation and a keen understanding of the intricacies of the semiconductor industry, Kumar has established himself as a thought leader and expert in the field. He is the founder of Techovedas, India’s first semiconductor and AI tech media company, where he shares insights, analysis, and trends related to the semiconductor and AI industries.

Kumar Joined IISER Pune after qualifying IIT-JEE in 2012. In his 5th year, he travelled to Singapore for his master’s thesis which yielded a Research Paper in ACS Nano. Kumar Joined Global Foundries as a process Engineer in Singapore working at 40 nm Process node. He couldn’t find joy working in the fab and moved to India. Working as a scientist at IIT Bombay as Senior Scientist, Kumar Led the team which built India’s 1st Memory Chip with Semiconductor Lab (SCL)

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