$150 Million Power Play: South Korea Invests in the Future of Chip Packaging

South Korea commits $150 million over 7 years for R&D in advanced semiconductor packaging, focusing on HBM memory chips.

South Korea commits $150 million over 7 years for R&D in advanced semiconductor packaging, focusing on HBM memory chips.

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In contrast, Apple has faced challenges in the Chinese market, with iPhone sales declining by an estimated 19% during the same period.

Attempting to export a machine used for processing silicon wafer microchips to a blacklisted Chinese company (Changdu GaStone Technology Company)

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The S.Korean memory giant was set to build a NAND fab at the site but changed the plan to meet rising HBM demand

Revenue grew 17% to $61.9 billion
Operating income grew 23% to $27.6 billion Earnings: $2.94 per share, up by 20%

The factory aims to produce lithography materials for chipmaking. Shin-Etsu plans to complete the first phase of investment by 2026 to meet increasing customer demand and expand its production base.