Sk Overtakes LG

SK hynix and TSMC Join Forces to pool their advanced packaging capabilities for AI chips

SK hynix and TSMC strategically ally to execute a "One Team" strategy, focusing on jointly developing HBM4, the next generation of high-bandwidth memory, offering enhanced compatibility compared to current products.
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In a strategic move to strengthen their positions in the competitive AI chip market, South Korean chipmaker SK hynix Inc. and Taiwan Semiconductor Manufacturing Co. (TSMC) have announced a collaborative alliance. SK Hynix excels in producing high-bandwidth memory (HBM) for generative AI, while TSMC holds the title of the world’s largest semiconductor foundry.

This partnership aims to leverage their technical expertise to advance the development of next-generation AI semiconductor packaging, particularly focusing on the sixth generation of HBM, known as HBM4.

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SK hynix has emerged as a key player in the HBM market, gaining prominence with the increasing popularity of generative AI.

On the other hand, TSMC is a dominant force in semiconductor manufacturing, producing graphics processing units (GPUs) for industry leader Nvidia Corp.

The collaboration between these two giants is strategically consolidating their positions in the AI chip market and establishing a united front against competitors, notably Samsung Electronics Co.

Strategic Goals:

SK hynix and TSMC strategically ally to execute a “One Team” strategy, focusing on jointly developing HBM4, the next generation of high-bandwidth memory, offering enhanced compatibility compared to current products.

Industry insiders suggest that TSMC may play a crucial role in handling certain processes related to HBM4, contributing to advancements in AI semiconductor technology.

Read More: Samsung vs. SK Hynix in the Battle for HBM Dominance – techovedas

Market Dynamics:

Both companies are actively enhancing their influence in the AI chip market, where they face fierce competition from Nvidia Corp. TSMC’s dominance in manufacturing Nvidia’s GPUs has positioned it as a key player in the industry.

SK hynix, on the other hand, holds over half of the market share in the HBM market, supporting GPU computations. This collaboration anticipates propelling both companies as major forces in the growing AI semiconductor market.

Counteracting Competition:

One of the key motivations behind the alliance is seen as a strategic move to counteract the influence of Samsung Electronics Co.

Following a challenging semiconductor downturn in 2023, Samsung Electronics has reportedly lagged behind both SK hynix and TSMC in the AI chip sector due to delayed decision-making in business strategies.

Samsung, a formidable competitor in both the foundry and memory chip markets, is aiming to reverse the situation in the HBM4 market by implementing a turnkey strategy.

Read More: U.S. Set to Indefinitely Suspend Equipment Restrictions for Samsung and SK Hynix in China – techovedas

Industry Response:

Industry experts perceive the collaboration between SK hynix and TSMC as a driving force in the AI semiconductor market, with their combined technical capabilities expected to substantially propel advancements in AI chip technology.

Ahn Ki-hyun, the executive director of the Korea Semiconductor Industry Association, underscored the potential impact of the collaboration, emphasizing its significance in the competitive landscape.


The SK hynix and TSMC alliance marks a significant development in the semiconductor industry, particularly in the context of the rapidly evolving AI chip market.

Pooling their technical expertise and resources, both companies are actively shaping the future of AI semiconductor packaging through collaborative efforts.

This strategic move not only strengthens their market positions but also positions them as formidable contenders against industry rivals, particularly Samsung Electronics. The partnership is expected to drive innovation and competitiveness in the AI semiconductor sector significantly.

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