“As we enter the Angstrom Era and look beyond five nodes in four years, continued innovation is more critical than ever. At IEDM 2023, Intel showcases its progress with research advancements that fuel Moore’s Law, underscoring our ability to bring leading-edge technologies that enable further scaling and efficient power delivery for the next generation of mobile computing.”
For Semiconductor SAGA : Whether you’re a tech enthusiast, an industry insider, or just curious, this book breaks down complex concepts into simple, engaging terms that anyone can understand.The Semiconductor Saga is more than just educational—it’s downright thrilling!
For Chip Packaging : This Book is designed as an introductory guide tailored to policymakers, investors, companies, and students—key stakeholders who play a vital role in the growth and evolution of this fascinating field.
