
“By banning the export of EUV, China will lag 10 to 15 years behind the West. That really has an effect.”

IBM's update highlighted a significant reduction of over 50% in the depth of focus for High-NA EUV. This reduction necessitates precise control over resist thickness and planarity, requiring them to be maintained below 30 nm.

EUV is absorbed by glass, necessitating the use of mirrors for focusing, for starters. Each mirror absorbs approximately 30% of the light, and in a typical system with 10 mirrors, only a small fraction of the original power reaches the mask.

Importing EUV machines, currently the primary and dependable means for producing 5nm chips and smaller, into China is restricted due to trade sanctions. Canon offers a novel approach to China's problem