Top 3 Books to Conquer Semiconductor Packaging & Assembly
The most comprehensive books on semiconductor backend assembly, providing a roadmap for those eager to delve into this complex yet fascinating field.
Tag Packaging
5 Ways Chip Packaging Will Define Next Generation of Chips
The vital role played by Packaging in extending Moore's Law, managing heat in High-Performance Computing (HPC), and integrating diverse components seamlessly is explored.
Amkor to Build $2 Billion Plant in USA; Packaging Chips for TSMC, Apple
The project is anticipated to generate around 2,000 jobs and will collaborate with a significant chipmaking complex in the northwest Valley.
What is 2D, 2.5D & 3D Packaging of Integrated Chips?
3D IC packaging is like stacking books on top of each other. Each “book” or chip has its own function, and they’re connected vertically, like a staircase between books. This allows us to add more books in the same shelf space, making the system faster and more efficient. It’s like building skyscrapers in a city to save space.
U.S. launches $3 billion Program for Advanced Semiconductor Packaging
By investing in domestic packaging capabilities and research and development, the program aims to create a thriving semiconductor ecosystem.
