Taiwan’s Power Chip Electronics Manufacturing to Mass-Produce MRAM; to be Used in Gen AI

Taiwan's Power Chip Electronics Manufacturing is set to drive the mass production of MRAM, a pivotal advancement in semiconductor technology. This move positions Taiwan at the forefront of the industry, showcasing its commitment to innovation and technological leadership.

Introduction:

In a significant stride towards advancing semiconductor technology, Taiwan’s Power Chip Electronics Manufacturing (PSMC) has announced its plans to mass-produce Magnetic Random Access Memory (MRAM) in collaboration with Power Spin, a company founded by Tohoku University in Japan. This partnership aims to harness the potential of MRAM, a memory technology with promising features such as reduced power consumption, high-speed data read and write capabilities, non-volatile data storage, and potential applications in data centers for AI generation.

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Understanding MRAM Technology:

MRAM, or Magnetic Random Access Memory, is a cutting-edge memory technology that holds the promise of revolutionizing the semiconductor landscape. Moreover,the key advantages of MRAM include its ability to reduce power consumption to a mere one percent of existing memory technologies, high-speed data processing, and the retention of data even in the event of a power outage. Additionally, MRAM boasts excellent data storage performance, making it a potential game-changer in the field of memory technologies.

MRAM, or Magnetoresistive Random Access Memory, is a type of non-volatile memory that uses magnetic charges to store data. It has several potential applications due to its unique characteristics:

High-Speed Cache Memory:

MRAM can be used as a cache memory in computing systems, providing fast access to frequently used data. Its speed is comparable to that of SRAM (Static Random Access Memory), making it suitable for applications requiring high-speed memory access.

Embedded Memory:

MRAM can be integrated into microcontrollers, ASICs (Application-Specific Integrated Circuits), and other integrated circuits as embedded memory. Its non-volatile nature makes it suitable for storing critical system configuration data, firmware, and boot code.

Storage Class Memory (SCM):

MRAM has the potential to serve as a new type of storage class memory, bridging the gap between volatile and non-volatile memory technologies. It offers faster access times compared to traditional NAND flash memory and does not suffer from the same limitations related to write endurance and data retention.

Enterprise Storage:

In data centers and enterprise storage systems, MRAM can be used as a persistent cache or as part of a tiered storage architecture to accelerate data access and improve system performance.

Automotive Electronics:

MRAM’s resilience to extreme temperatures, radiation, and magnetic interference makes it suitable for use in automotive electronics, such as advanced driver assistance systems (ADAS), infotainment systems, and engine control units (ECUs).

Industrial and Aerospace Applications:

MRAM’s durability and reliability make it ideal for harsh environments like industrial automation, aerospace, and military use. Its speed, non-volatility, and robustness make it promising for diverse applications, from consumer electronics to critical systems.

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Collaboration with Power Spin:

Power Chip Electronics Manufacturing will collaborate with Power Spin, a company affiliated with Tohoku University in Japan, to leverage semiconductor technology research. Additionally, Power Spin will provide technological inputs to Power Semiconductor, facilitating research and trial production. The aim is to initiate mass production by 2029, with the potential application of MRAM in data centers for AI processing.

Challenges and Advancements:

Despite MRAM’s theoretical benefits, overcoming challenges like high manufacturing costs, durability issues, and reliability concerns is essential for widespread adoption. PSMC and Japan’s SBI Holdings have formed a joint venture to build a semiconductor mass production factory in Ohiro Village, Miyagi Prefecture. The project has two phases: the first launching in 2027 and the second in 2029, with a total investment of 800 billion yen. The Japanese government has also provided substantial subsidies, demonstrating the strategic importance of this venture.

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Market Outlook and Competition:

Everspin Technologies, a prominent American semiconductor company, is already mass-producing MRAM. Tetsuro Endo, a professor at Tohoku University and Chief Technology Officer of Power Spin, predicts the MRAM market will hit 30 billion yen in 2022. The push for mass production and cost reduction is heating up, with semiconductor foundries pushing MRAM adoption.

Conclusion:

The collaboration between Power Chip Electronics Manufacturing and Power Spin advances MRAM mass production. It’s crucial amid rising demand for power-saving memory solutions, especially with the growth of generative AI applications. Successful MRAM implementation could revolutionize semiconductor tech. Ongoing research, investments, and partnerships are driving efficient, high-performance MRAM development. This vision could soon reshape memory technology, offering cost-effective solutions.

Kumar Priyadarshi
Kumar Priyadarshi

Kumar Joined IISER Pune after qualifying IIT-JEE in 2012. In his 5th year, he travelled to Singapore for his master’s thesis which yielded a Research Paper in ACS Nano. Kumar Joined Global Foundries as a process Engineer in Singapore working at 40 nm Process node. Working as a scientist at IIT Bombay as Senior Scientist, Kumar Led the team which built India’s 1st Memory Chip with Semiconductor Lab (SCL).

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