Introduction:
The future of AI hardware depends on precision — and no step is more crucial than testing. On September 25, 2025, Teradyne received the TSMC Open Innovation Platform (OIP) Partner of the Year Award for 3DFabric® Testing, recognizing its cutting-edge contributions to advanced semiconductor validation.
This award marks more than a corporate accolade; it highlights how two semiconductor powerhouses — Teradyne and TSMC — are jointly shaping the next era of multi-die testing and AI chip innovation.
Their collaboration is unlocking new frontiers in heterogeneous integration, 3D packaging, and high-speed chiplet testing, vital for today’s AI-driven world.
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5-Point Overview
Teradyne won TSMC’s 2025 OIP Partner of the Year for its role in advancing 3DFabric Testing.
The partnership focuses on multi-die and chiplet test methodologies, particularly for CoWoS® and InFO packaging.
TSMC’s Open Innovation Platform (OIP) drives collaboration among EDA, IP, and ecosystem partners to accelerate innovation.
Teradyne’s UCIe and streaming scan solutions boost test speed, quality, and yield for AI and HPC chips.
The collaboration strengthens AI hardware testing and redefines the future of heterogeneous integration.
The Power of Partnership: TSMC and Teradyne
Teradyne, based in North Reading, Massachusetts, has long been a leader in automated test equipment (ATE) for semiconductors, electronics, and robotics.
From wafer-level validation to final assembly testing, Teradyne’s systems ensure high-quality and high-reliability performance across the electronics industry.
Meanwhile, TSMC — the world’s largest semiconductor foundry — continues to push boundaries with its advanced nodes (A16, N2, N3) and 3DFabric® packaging technologies.
The company’s Open Innovation Platform (OIP), launched in 2008, serves as a collaborative framework uniting EDA tool developers, IP vendors, and ecosystem partners to speed up chip design and manufacturing.
Together, Teradyne and TSMC exemplify how strategic partnerships can enable breakthroughs in AI computing, high-performance chips, and advanced packaging.
TSMC’s 3DFabric: The Engine of Advanced Integration
At the core of this collaboration is TSMC’s 3DFabric® platform. It is a suite of 2.5D and 3D silicon stacking technologies, including CoWoS® (Chip-on-Wafer-on-Substrate) and InFO (Integrated Fan-Out).
These technologies let multiple chips, or chiplets, fit into a single package. This design boosts bandwidth, power efficiency, and computational density.
For AI accelerators and cloud data center processors, it enables faster communication between memory and logic dies. This reduces latency and improves energy efficiency.
As multi-die designs grow more complex, ensuring reliable performance becomes challenging. This is where Teradyne’s innovations play a key role.
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Teradyne’s Cutting-Edge Testing Solutions
Testing is the silent hero of semiconductor innovation. Every AI chip or processor undergoes rigorous validation. This ensures billions of transistors and interconnects function correctly under real-world workloads.
Teradyne’s contributions to TSMC’s 3DFabric Testing include several key technologies:
- UCIe (Universal Chiplet Interconnect Express) Testing: Enables seamless, high-speed data transfer between chiplets. Supports the industry standard for die-to-die communication.
- Streaming Scan Test: Speeds up high-volume testing. Transmits scan data over die-to-die links for better efficiency and fault coverage.
- GPIO-Based Solutions: Allow flexible probing and debugging of multi-die systems during wafer sort. Reduces time-to-yield.
Together, these capabilities improve silicon bring-up, minimize defect escapes, and ensure AI-ready chiplets perform consistently across devices.
For large-scale AI and HPC systems, this translates to higher reliability, better performance, and faster market readiness.
The 2025 OIP Forum: Recognizing Innovation
The 2025 TSMC North America OIP Ecosystem Forum, held in Santa Clara, California, served as the platform for the award announcement.
The event brought together global industry leaders, researchers, and partners to discuss the latest advancements in AI-accelerated chip design and 3D integration.
During the event, Shannon Poulin, President of Teradyne’s Semiconductor Test Group, emphasized the power of collaboration:
“We strongly believe in the open and collaborative ecosystem approach of TSMC’s Open Innovation Platform and look forward to continuing our partnership to drive innovation and deliver exceptional value to our customers.”
Aveek Sarkar, Director of TSMC’s Ecosystem and Alliance Management Division, congratulated Teradyne, highlighting how their work enhances silicon bring-up efficiency and supports energy-efficient AI computing.
These remarks underline a shared vision — innovation through openness — a principle that defines TSMC’s OIP ecosystem.
Why This Partnership Matters for the AI Era
The rapid expansion of AI, data centers, and edge computing has transformed semiconductor design. Traditional monolithic SoCs are giving way to modular chiplet architectures, where performance depends on how efficiently individual dies communicate and operate together.
This shift demands new testing methodologies that can validate interconnects, latency, and signal integrity across dies.
Teradyne’s innovations, combined with TSMC’s 3DFabric platform, provide the testing precision and scalability needed for the next wave of AI and HPC chips.
By addressing challenges like power distribution, heat management, and interface reliability, the partnership ensures that AI systems can operate faster, cooler, and more efficiently — critical in a world increasingly defined by compute-intensive workloads.
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A Partnership That Shapes the Industry
The Teradyne–TSMC collaboration also represents a template for future ecosystem partnerships.
As the semiconductor industry becomes more fragmented, no single company can innovate in isolation. Instead, cross-industry alliances like OIP enable the integration of diverse technologies — from design software to packaging materials — into a unified production pipeline.
By fostering this collaborative approach, TSMC and Teradyne are not just advancing technology but also building a sustainable innovation ecosystem that benefits chip designers, system integrators, and end-users alike.
Looking Ahead: Testing the Limits of Tomorrow
As semiconductor packaging evolves toward 3D stacking and chiplet modularity, testing will become even more critical.
Teradyne’s continued investments in AI-driven test analytics, automation, and parallel testing will further optimize cost and performance.
Meanwhile, TSMC’s roadmap — spanning advanced nodes like A16, N2P, and N3E — will push process limits even further, demanding tighter integration between manufacturing, packaging, and testing.
Together, these developments promise a future where AI chips are more reliable, energy-efficient, and scalable — powering the next generation of computing breakthroughs.
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Conclusion: Precision Meets Partnership
The 2025 OIP Partner of the Year award is more than recognition. It signals the future of the semiconductor industry.
Teradyne’s precision testing and TSMC’s packaging expertise form a powerful duo. Every AI chip leaving the fab is tested, trusted, and ready.
As AI systems grow in complexity, this collaboration becomes essential. It builds the foundation for smarter, faster, and more sustainable computing.
Contact us at [email protected] to explore opportunities today!
