TSMC Global Expansion: Why Making Chips Abroad Is Like Eating ‘Din Tai Fung’ in the U.S.

TSMC’s decision to manufacture chips overseas is like enjoying Din Tai Fung in the U.S.—preserving authenticity while adapting to local markets.

Introduction

During a recent address, TSMC CEO Dr. C.C. Wei shared a light-hearted yet deeply insightful analogy to highlight the challenges of Global expansion overseas semiconductor manufacturing chips. “Eating Din Tai Fung in the U.S. is more expensive and not as tasty,” he quipped, drawing laughter from the audience. But beneath the humor lies a serious message about the operational complexities and economic hurdles of building fabs outside Taiwan. As TSMC — the crown jewel of global chipmaking — expansion its footprint to the U.S., Japan, and Germany, Dr. Wei’s comments offer a candid look into why replicating Taiwan’s semiconductor magic is more than just duplicating infrastructure.

Let’s dive into what this means for the chip industry, global geopolitics, and the semiconductor supply chain.

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TSMC’s Assurance: Yields Are Fine, Technology Is Safe

First and foremost, Dr. Wei assured that TSMC overseas operations maintain the same yield rates and mass production expansion standards as those in Taiwan. This directly addresses widespread concerns that talent or IP might be diluted or that advanced process nodes would perform sub optimally outside the company’s home base.

This is a key point. The biggest fear in geopolitically driven chip reshoring is that technology will suffer. Dr. Wei’s remarks make it clear that the technology and know-how can travel — TSMC has managed to replicate its manufacturing excellence abroad.

However, while the product quality remains intact, the experience — much like Dr. Wei’s Din Tai Fung reference — isn’t quite the same.

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The “Din Tai Fung” Analogy: More Than Just Humor

Let’s unpack the analogy. Din Tai Fung, a world-famous Taiwanese dumpling chain, offers a near-spiritual culinary experience in Taiwan — affordable, authentic, and consistently high-quality. But the same dish in a foreign country? It’s more expensive, and lacks the magic of the original.

Dr. Wei’s comparison underscores a few critical insights:

Higher Costs: Manufacturing chips abroad comes with higher construction, labor, and operational expenses. The U.S., in particular, struggles with a lack of skilled semiconductor labor and expensive regulatory frameworks. According to industry estimates, building a fab in the U.S. costs 3–5x more than in Taiwan.

Cultural & Operational Friction: Just as a restaurant abroad can’t easily replicate local ingredients or staff expertise, fabs face subtle yet significant barriers abroad — from language and cultural mismatches to slower decision-making and supply chain rigidity.

Ecosystem Deficiency: Taiwan semiconductor ecosystem is tightly integrated — foundries, packaging houses, equipment suppliers, and skilled workers are all within a short drive. Rebuilding that in Arizona, Kumamoto, or Dresden takes time and massive investment.

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Strategic Implications: Why Is TSMC Still Going Global?

Despite these challenges, TSMC is not retreating from its global expansion. On the contrary, it’s accelerating investments — with multibillion-dollar fabs in the U.S., Japan, and soon Germany.

Why? Several reasons:

Geopolitical Insurance: Clients like Apple, NVIDIA, and AMD — not to mention the U.S. government — are increasingly nervous about Taiwan’s vulnerability to geopolitical tensions. Diversifying geography = risk mitigation.

Customer Pressure: Big clients are demanding local production for reasons ranging from national security to supply chain resilience. TSMC is following the customer.

Incentives: Generous subsidies from the CHIPS Act (U.S.), Japan’s Ministry of Economy, Trade and Industry (METI), and Germany’s state and EU-backed funds are helping to cushion the cost gap.

But these moves come with trade-offs, and Dr. Wei’s comments reflect a deeper truth: money can’t instantly buy efficiency, culture, or deep-rooted ecosystems.

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The Real Takeaway: Chipmaking Is Not (Just) About Equipment

The semiconductor world often assumes that if you have the same EUV machines, cleanrooms, and blueprints, you can make a 5nm chip anywhere. Dr. Wei reminds us that semiconductor manufacturing is an art as much as a science.

It takes:

Decades of institutional knowledge

Seamless supply chains

Hard-earned operational rhythms

Cultural coherence and communication

That’s what Taiwan has. That’s what’s hard to replicate — and that’s why the dumplings taste different, even if the recipe is the same.

Looking Ahead: Building Resilience vs. Chasing Perfection

The challenge for TSMC (and the world) expansion is to find a balance:

Resilience is the goal — not necessarily replicating Taiwan’s cost or cultural advantages.

Redundancy, even if inefficient, may be the price we pay for security.

And local fabs might not make financial sense today, but could be priceless in a future where supply chains are disrupted.

As the semiconductor world undergoes the largest geographic restructuring in decades, Dr. Wei’s Dumpling Doctrine should be kept in mind: just because you can make it elsewhere doesn’t mean it’ll taste the same — or cost the same.

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Conclusion

Dr. C.C. Wei’s remarks are a masterclass in using humor to convey hard truths. TSMC is rising to the global expansion challenge, but the world must temper its expectations.

As countries rush to become chip sovereign, they would do well to understand that building fabs is easy; building ecosystems is hard.

So the next time you’re in the U.S. craving xiaolongbao, or a politician dreams of the next Silicon Valley — remember the Din Tai Fung analogy.

Because in chips, just like in dumplings, the devil’s in the details.

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Kumar Priyadarshi
Kumar Priyadarshi

Kumar Joined IISER Pune after qualifying IIT-JEE in 2012. In his 5th year, he travelled to Singapore for his master’s thesis which yielded a Research Paper in ACS Nano. Kumar Joined Global Foundries as a process Engineer in Singapore working at 40 nm Process node. Working as a scientist at IIT Bombay as Senior Scientist, Kumar Led the team which built India’s 1st Memory Chip with Semiconductor Lab (SCL).

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