What to Expect from Apple’s 20th Anniversary iPhone: HBM Memory, Seamless Screen, and Pure Silicon Battery

Expect a seamless screen design for an immersive display experience. Plus, Apple may introduce pure silicon battery technology to enhance battery life and efficiency.

Introduction

Apple is already shaping up for a landmark release in 2027: the 20th anniversary Apple’s iPhone. According to a recent report by etnews, the tech giant is preparing to unveil significant innovations that could redefine mobile technology.

Industry insiders say Apple is focused on major upgrades like advanced memory technology, a truly seamless display, and a new type of battery. Here’s a detailed look at what to expect from the next-generation iPhone.

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5 Key Highlights to Watch for in the 2027 iPhone

High Bandwidth Memory (HBM) for AI Power

Full-Screen Display with Under-Display Camera

Next-Gen OLED Display Driver IC

Pure Silicon Battery Technology

Enhanced DRAM and Memory Channels

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Unlocking On-Device AI with High Bandwidth Memory (HBM)

Apple plans to boost iPhone AI performance. It aims to use mobile High Bandwidth Memory (HBM) in its 2027 lineup. HBM delivers faster data transfer and higher capacity. This upgrade will enhance on-device AI computations.

Apple is in talks with memory suppliers. Samsung and SK hynix are key partners. Both are developing packaging tech to mass-produce mobile HBM by late 2026.

Samsung uses the Vertical Cu-post Stack (VCS) method. SK hynix works on Vertical Wire Fan Out (VFO) technology. Both aim to boost bandwidth while cutting size and power use.

Apple has been improving memory capacity. The iPhone 17 series will feature 12GB of DRAM. Samsung will supply about 70% of it.

The iPhone 18 will use 6-channel LPDDR5X memory by 2026. This upgrade will increase speed and efficiency.

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A Truly Seamless Full-Screen Display

Smartphone displays have evolved rapidly, but the “full-screen” design Apple plans for 2027 is set to push boundaries further. Current iPhones already have minimal bezels, but the 2027 model aims for a genuinely uninterrupted screen.

The new design will likely combine:

  • Under-Display Camera (UDC) technology, hiding the front camera beneath the screen.
  • Four-sided OLED edge bending for an immersive look with no visible borders.

Additionally, Apple plans to improve power efficiency by adopting a 16nm FinFET process for the OLED Display Driver IC (DDI), a crucial chip that controls the screen’s display.

This new process will reduce power draw and help preserve battery life despite the advanced display tech.

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Pure Silicon Battery: A Game-Changer for Mobile AI

Battery technology is critical, especially as on-device AI demands more power. Apple reportedly collaborates with multiple battery manufacturers to develop a pure silicon battery, replacing traditional graphite anodes with silicon.

Why does this matter? Silicon anodes can store much more energy in the same volume — potentially offering longer battery life and faster charging speeds.

This breakthrough is essential to support power-hungry AI features without compromising the iPhone’s sleek form factor.

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The Road Ahead for Apple’s iPhone Memory

iPhone ModelMemory SpecsSupplier InsightsExpected Release
iPhone 1712GB DRAMSamsung to supply ~70%2025-2026
iPhone 186-channel LPDDR5XIn development2026
iPhone 20Mobile High Bandwidth MemorySamsung (VCS) & SK hynix (VFO)Mass production post-2026

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Conclusion

Apple’s 2027 iPhone promises to be a milestone device, commemorating two decades of innovation with groundbreaking upgrades.

From the adoption of high-speed HBM to enable powerful on-device AI, a seamless true full-screen display, to revolutionary pure silicon battery tech, Apple aims to redefine user experience and device performance.

These developments not only highlight Apple’s commitment to pushing smartphone boundaries but also set the stage for the next era of mobile technology.

As the launch approaches, investors and tech enthusiasts alike should keep a close eye on how these emerging technologies shape Apple’s future.

As the tech landscape evolves, the balance between convenience and privacy will remain a critical issue. Apple’s settlement may close this chapter, but the broader debate is far from over.

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Kumar Priyadarshi
Kumar Priyadarshi

Kumar Joined IISER Pune after qualifying IIT-JEE in 2012. In his 5th year, he travelled to Singapore for his master’s thesis which yielded a Research Paper in ACS Nano. Kumar Joined Global Foundries as a process Engineer in Singapore working at 40 nm Process node. Working as a scientist at IIT Bombay as Senior Scientist, Kumar Led the team which built India’s 1st Memory Chip with Semiconductor Lab (SCL).

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