Introduction
On June 28, 2024, CEA-Leti announced the kick-off of the FAMES Pilot Line, a groundbreaking initiative designed to propel semiconductor technologies in Europe.
Focus: Develop advanced chip technologies like FD-SOI at 7nm and 10nm, embedded memories, radio frequency components, and 3D integration techniques.
Funding: €830 million project funded by EU member states and the Chips Joint Undertaking.
Significance: Aligned with the European Chips Act to strengthen Europe’s technological sovereignty.
Accessibility: Open to research institutions, universities, and companies in the EU through an application process.
This ambitious project, with an 830 million euro investment, is part of the EU Chips Act’s strategy to enhance EU semiconductor capabilities and ensure technological sovereignty.
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Aiming for Technological Sovereignty
CEA-Leti (French: Laboratoire d’électronique des technologies de l’information) is a research institute headquartered in Grenoble, France. It’s one of the world’s leading organizations for applied research in microelectronics and nanotechnology. Founded in 1967, they’ve been at the forefront of developing innovative technologies for decades.
Here’s what CEA-Leti does:
- Research: They focus on micro and nanotechnologies for various applications, including wireless communication, healthcare, imaging, and micro-nano systems.
- Development: They work closely with industry partners to translate their research into real-world technologies and products.
- Collaboration: They have a strong network of partners, including startups, SMEs, and large corporations, to accelerate innovation and commercialization.
Think of them as a powerhouse of expertise, driving advancements in tiny technologies with big impacts.
FAMES Pilot Line: Europe’s Chip Revolution
The FAMES Pilot Line is a major initiative spearheaded by CEA-Leti. It’s essentially a state-of-the-art facility dedicated to developing and testing advanced semiconductor technologies in Europe.
Here’s what FAMES aims to achieve:
- Advanced Chip Technologies: Develop next-generation chips like those based on 7nm and 10nm FD-SOI (a technology invented by CEA-Leti itself) along with embedded memory, radio frequency components, and 3D integration techniques.
- European Self-Sufficiency: Reduce Europe’s reliance on foreign chip suppliers and strengthen its technological independence.
- Innovation Hub: Foster collaboration between researchers, universities, and companies across Europe to accelerate breakthroughs in chip technology.
- Sustainability Focus: Develop these technologies with an eye towards minimizing environmental impact, aligning with the growing demand for eco-friendly solutions.
The FAMES Pilot Line is a €830 million project funded by the EU and member states. It’s a significant investment aimed at propelling Europe to the forefront of chip development.
Aligning with the EU Chips Act
The FAMES Pilot Line aligns seamlessly with the EU Chips Act, aiming to bolster Europe’s semiconductor capabilities and secure its position as a global leader in semiconductor technology.
The initiative is expected to develop five cutting-edge semiconductor technologies that will drive innovation and sustainability in various high-tech sectors.
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Developing Next-Generation Semiconductor Technologies
Focus on Advanced Semiconductor Solutions
The FAMES Pilot Line will focus on five key technological areas:
FD-SOI (Fully Depleted Silicon-On-Insulator): Developing two new generation nodes at 10nm and 7nm.
Embedded Non-Volatile Memories: Including OxRAM, FeRAM, MRAM, and FeFETs.
Radio-Frequency Components: Encompassing switches, filters, and capacitors.
3D Integration Options: Featuring both heterogeneous integration and sequential integration.
Small Inductors: For developing DC-DC converters for Power Management Integrated Circuits (PMIC).
Read More: Why GlobalFoundries Abandoned the Sub-7 nm Race: A Detailed Analysis – techovedas
FD-SOI: A Pioneering Technology
Innovation in Semiconductor Manufacturing
Invented by CEA-Leti, FD-SOI is a planar CMOS technology known for its superior PPAC-E (Performance, Power, Area, Cost, and Environmental impact) metrics. It offers tight electrostatic control at the transistor level and is ideal for innovative power-management technologies. The booming FD-SOI market is eagerly anticipating the next-generation nodes at 10nm and 7nm, promising further advancements in semiconductor efficiency and performance.
Collaboration Across the Semiconductor Value Chain
Building a Vibrant Ecosystem
The FAMES initiative has garnered support from 43 companies across the electronic-systems value chain, including materials providers, equipment manufacturers, fabless companies, EDAs, IDMs, and system houses. This collaborative effort prefigures a dynamic ecosystem of start-ups, SMEs, and global industry leaders, all contributing to the advancement of semiconductor technologies.
Strategic Partnerships and Consortium
Leading European Institutions
The FAMES Consortium unites top-tier partners:
- CEA-Leti (France)
- imec (Belgium)
- Fraunhofer Mikroelektronik (Germany)
- Tyndall (Ireland)
- VTT (Finland)
- CEZAMAT WUT (Poland)
- UCLouvain (Belgium)
- Silicon Austria Labs (Austria)
- SiNANO Institute (France)
- Grenoble INP-UGA (France)
- University of Granada (Spain)
Creating Market Opportunities
Diverse Applications and Market Impact
The FAMES Pilot Line will pave the way for new market opportunities in various high-tech domains. These include low-power microcontrollers (MCUs), multi-processor units (MPUs), AI and machine learning devices, smart data-fusion processors, RF devices, 5G/6G chips, automotive chips, smart sensors and imagers, trusted chips, and new space components.
Ensuring Accessibility and Collaboration
Open Calls for EU Stakeholders
The pilot line will be accessible to all EU stakeholders, including universities, research and technology organizations (RTOs), SMEs, and industrial companies.
Annual open calls and a fair, non-discriminatory selection process will ensure widespread participation and collaboration.
Funding and Support
The FAMES project will benefit from 830 million euros in funding, equally provided by participating member states and the Chips Joint Undertaking (Chips JU).
This substantial investment underscores the strategic importance of the initiative in enhancing Europe’s semiconductor capabilities.
Commitment to Sustainability
The FAMES project places a strong emphasis on sustainability, integrating advanced technologies to create smarter, greener, and more efficient semiconductor solutions.
This focus on sustainability will ensure that Europe remains at the forefront of semiconductor innovation while addressing environmental challenges.
Conclusion
The launch of the FAMES Pilot Line marks a significant milestone in Europe’s quest for semiconductor leadership.
By developing next-generation technologies and fostering collaboration across the value chain, the initiative will drive innovation, enhance sustainability, and secure Europe’s position in the global semiconductor landscape.
