Introduction
Intel, a global leader in semiconductor technology, has embarked on numerous ambitious projects worldwide. It is aiming to advance chip manufacturing, innovation, and research. From state-of-the-art fabrication facilities to cutting-edge research centers, Intel’s investments underscore its commitment to shaping the future of technology. In this article, we delve into Intel’s 10 largest semiconductor projects worldwide, highlighting their significance and impact on the semiconductor industry.
Intel’s Global Expansion: Recap of Top 10 Building Projects and Future Outlook for 2024
For more than 50 years, Intel has focused on driving innovation, investing in global semiconductor manufacturing, and advancing research and development to propel the digital era forward.
The year 2023 was no different, with Intel teams worldwide installing new equipment, introducing fresh clean rooms, and finishing construction on new buildings.
Notable statistics from 2023 include the use of approximately 145,000 tons of steel for constructing and expanding these facilities.
Additionally, construction crews poured over 2 million cubic yards of concrete across all Intel projects throughout the year, an amount sufficient to construct New York’s Empire State Building 32 times over.
Keyvan Esfarjani, Intel’s executive vice president and chief global operations officer, emphasized the crucial role of Intel’s global manufacturing to meet the projected growth in global semiconductor demand.
In the same light, here’s a recap of Intel’s 10 largest building projects worldwide – in Arizona, New Mexico, Ohio, Oregon, Ireland, Israel, Magdeburg, Penang and Kulim in Malaysia, and Poland – and what to expect from these construction sites in 2024.
1. Arizona, U.S.
Fab 52 and 62 Concrete Superstructure Completed
Intel is making a substantial investment of over $32 billion in building two cutting-edge chip factories and upgrading an existing facility at its Ocotillo campus in Chandler, Arizona. The company aims to produce highly advanced logic chips at this location. A significant achievement for Fab 52 was reached in December 2023 with the completion of the concrete pour for the “cheese slab,” which serves as the foundation of the fab.
Construction efforts have seen the pouring of more than 430,000 cubic yards of concrete so far, equivalent to filling 132 Olympic-size swimming pools.
Additionally, they’ve made progress in installing the automated material handling system (AMHS) within the fab. This system acts like a fully automated highway, moving wafers between stations efficiently.
Read more 10 Fabrication Steps to Build a Semiconductor Chip – techovedas
2. New Mexico, U.S.
Tool Installs Continue in Fab 9 and Fab 11x Ahead of Foundry Ramp
Progress So Far: The previous year proved challenging for Intel New Mexico as teams successfully completed constructing pristine clean room facilities and aiding in the tool installations for Fab 9 and Fab 11x.
In late January, Intel commemorated the grand opening of Fab 9, which serves as the company’s cutting-edge packaging manufacturing center and currently stands as the sole U.S. based site for high-volume advanced packaging operations. Intel’s investment surpasses $4 billion to enhance operations at the Rio Rancho campus in New Mexico, focusing on advanced semiconductor packaging production. In the upcoming months, additional tools will be installed and validated at Fabs 9 and 11x.
3. Ohio, U.S.
More than 248,000 Dump Trucks Full of Dirt Moved
In Ohio, construction is in full swing at Intel’s first new U.S. site in over 40 years, boasting impressive figures. This includes the movement of over 4 million cubic yards of earth within the past year, equivalent to approximately 248,000 dump truck loads. Additionally, teams have successfully installed 10 miles of underground utilities and 32 miles of conduit.
The groundbreaking at the New Albany, Ohio, site took place in September 2022, with Intel committing over $28 billion toward the construction of two cutting-edge chip factories. The initial phase of the project is projected to generate 3,000 Intel jobs, 7,000 construction jobs, and around 10,000 indirect jobs.
In 2022, Intel also pledged an extra $100 million towards partnerships with educational institutions, aiming to cultivate a talent pipeline and enhance research programs in the area. This investment encompasses a $50 million global partnership with the National Science Foundation and a further $50 million dedicated to funding the Semiconductor Education and Research Program (SERP) for Ohio.
Throughout this year, the team will continue developing the new fab’s above-ground utility level and will be receiving superloads of manufacturing equipment from Manchester in Adams County to the Intel Ohio One campus in New Albany.
4. Oregon, U.S.
Breaking Ground on a New Manufacturing Support Building at Gordon Moore Park
Progress So Far: In September 2023, Intel marked the commencement of MSB2, a new support structure adjacent to the existing D1X fab, Intel’s primary Technology Development site. The company is set to invest over $36 billion in its R&D operations in Hillsboro, enabling Intel to deliver industry-leading process technology well into the future beyond 2025.
The site remains bustling with activity this year as construction progresses swiftly. Upon completion, MSB2 will offer an additional 35,000 square feet of clean room space, six truck docks to facilitate a rapid tool install for D1X, and an elevator capable of handling up to 65,000 pounds to accommodate the heaviest components of ASML‘s state-of-the-art High Numerical Aperture Extreme Ultraviolet (EUV) lithography scanners. ASML delivered its first High-NA EUV system to Intel in December.
5. Leixlip, Ireland
Fab 34 is Europe’s First Chip Fab to Use EUV in High-Volume Chipmaking
In September, the high-volume production of Intel 4 process technology (intel’s naming for 7nm process) officially commenced in Mod 1 of Fab 34, which stands as the first fab in Europe to employ EUV in mass manufacturing. As highlighted in an Intel Newsroom release, Esfarjani expressed the significance of Intel’s Ireland operations in the company’s global manufacturing network and in establishing a comprehensive semiconductor manufacturing value chain in Europe.
The event was celebrated as a crucial milestone in Intel’s ongoing 17-billion-euro investment. This achievement signifies the introduction of Intel’s cutting-edge Intel 4 technology utilizing EUV to benefit Fab 34, Ireland, and the broader European region. Subsequently, in January, Fab 34 marked the shipment of its first Meteor Lake. With Mod 1 now operational, focus has shifted towards advancing the next clean room, Mod 2, at the facility.
Read more The Journey of Pat Gelsinger: Intel’s Renaissance Man – techovedas
6. Kiryat Gat, Israel
Construction on a New $25 Billion Fab is Underway
In Kiryat Gat, where Intel’s most advanced manufacturing facility in Israel is situated, Intel is imminently introducing Fab 38. Positioned adjacent to Fab 28, this $25 billion expansion will manufacture advanced chips utilizing EUV lithography.
Presently, Intel’s Israel site accommodates approximately 11,000 employees across four key locations: Haifa (a pivotal hardware and software development hub for processors and AI), Petah Tikvah (a center for communication and AI solutions development), Jerusalem (housing Mobileye’s global development center for autonomous cars, alongside communication, software, and cybersecurity development), and Kiryat Gat.
The year 2024 marks the 50th anniversary of Intel Israel’s operations.
Read more Intel to Invest $25 Billion in Israel; Facility 20 Miles from Gaza Strip – techovedas
7. Magdeburg, Germany
Being Good Neighbours and New Apprenticeship Program
Progress So Far :
In June 2023, Intel shared an updated letter of intent with the German government, seeking to broaden the scope of government incentives for its proposed wafer fabrication site in Magdeburg.
In September, Intel leaders showed their dedication to the local community as the Magdeburg site progresses.
They participated in the Ottersleben Summer Fair, a popular community event, where they set up an Intel demonstration booth and held panel discussions.
Their participation in the Ottersleben Summer Fair, a well-attended community event, includedd an Intel demonstration booth and panel discussions.
There is great enthusiasm within teams for the introduction of a new technical internship program this year. This initiative will involve apprentices spending two years in Magdeburg, followed by a third year at Intel’s fab in Ireland. They are offering them firsthand experience in operating fab tools. Additionally, Intel prioritizes contributing to the region’s future in collaboration with the local community. This was recently illustrated through a technical partnership with sports clubs SC Magdeburg and 1. FC Magdeburg.
Read more Intel Fab in Germany Will be the Most Advanced Fab in the world with 1.5 nm Node – techovedas
8 & 9. Penang and Kulim, Malaysia
A $7 Billion Advanced Packaging Facility and a New ATM Factory Take Shape
Progress So Far:
Intel is making groundbreaking investments in cutting-edge chip factories in Arizona.
They are establishing advanced packaging hubs like Fab 9 in New Mexico.
Intel is also expanding in locations like Oregon, Ireland, Israel, Germany, Malaysia, and Poland. These projects underscore Intel’s strategic vision for global semiconductor leadership.
They demonstrate Intel’s commitment to technological progress and innovation.
Both teams are diligently preparing their respective construction sites for the imminent arrival of their first capital tools.
- In Kulim, Intel teams are set to commence the relocation of factory tools in the first half of the year.
- While in Penang, the teams are gearing up for the operational readiness of the new facility later in the year. Teams have started working together to move the first set of clean room equipment. This equipment began arriving in November in wooden crates from nearby warehouses to the site. Each crate weighs up to a ton.
Read more Intel to Build First Overseas 3D Chip Packaging Facility in Malaysia – techovedas
10. Wrocław West, Poland
Cooperating with Local Universities to Advance Science and Technology Curriculum
Progress So Far: In June 2023, Intel announced the establishment of a new assembly and test facility in Wrocław West . Poland, projected to accommodate approximately 2,000 employees. Valued at $4.6 billion, this initiative stands as Poland’s most extensive greenfield investment to date. They chose this location because of factors like the existing infrastructure, a skilled talent pool, and a favorable business environment.
Intel signed an agreement with Wrocław University of Science and Technology for joint research and development. They enhance educational programs to meet industry needs and provide lectures by Intel experts. Intel partners with the Ministry of Education and GovTech for Intel® Digital Readiness programs. They introduce AI teaching in secondary schools and collaborate with universities like Poznań University of Technology. In Krakow AGH University of Science and Technology, they inaugurated an Intel laboratory. They also introduced a new field of study at Silesian University of Technology.
Read more Why Intel is Not Considering to Build a Fab in India – techovedas
Conclusion
In conclusion, Intel’s worldwide construction projects showcase a significant commitment to advancing semiconductor manufacturing and innovation.
Intel is making groundbreaking investments in cutting-edge chip factories in Arizona. They are establishing advanced packaging hubs like Fab 9 in New Mexico.
Forward-looking expansions are happening in locations like Oregon, Ireland, Israel, Germany, Malaysia, and Poland. These projects underline Intel’s strategic vision for global semiconductor leadership and technological progress.
