Introduction
The South Korea’s government initiates a national project to advanced chip packaging technologies. The project aims to strengthen South Korea position in the global semiconductor industry especially packaging.
Recent reports indicate that the initiative has cleared the preliminary feasibility review conducted by KISTEP. This milestone marks a significant step in South Korea’s technological advancement journey.
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Preliminary Feasibility Review: A Key Milestone
The preliminary feasibility review, a rigorous evaluation process, typically scrutinizes projects exceeding 50 billion won in value and receiving over 30 billion won in direct government funding.
Notably, the chip packaging project surpassed this evaluation in one go, an uncommon feat, indicating the government’s recognition of its strategic importance.
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Budget Allocation and Significance
While the initial proposal envisioned a substantial budget of 500 billion won, the approved budget stands at 206.8 billion won over a seven-year period.
Despite the budget reduction, the project’s approval underscores the government’s commitment to advancing chip packaging technologies, crucial for South Korea to compete with industry leaders like Taiwan Semiconductor Manufacturing Company (TSMC).
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Project Components: Follower and First Mover Parts
The project, spearheaded by the Ministry of Trade, Industry and Energy and the Korea Evaluation Institute of Industrial Technology, comprises two key components: the follower part and the first mover part. These segments will operate independently, focusing on distinct areas of chip packaging innovation.
- Follower Part: Aimed at enhancing South Korea’s capabilities in heterogeneous integration package, wafer-level and panel-level packages, and flip-chip technologies. These technologies are currently dominated by industry giants such as TSMC, China’s JCET, and Amkor in the United States.
- First Mover Part: Concentrates on areas where South Korean companies hold a leadership position. High-bandwidth memory (HBM) and related technologies will receive significant funding, including advancements in 2.5D package-based HBM, hybrid bonding, and microjunctions ranging from 10 to 40 micrometers.
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Exploring Glass Substrate Technology
One aspect yet to be clarified is the inclusion of glass substrate technology in the project. Global chipmakers are increasingly exploring the use of glass substrates in chip packaging, citing their superior heat resistance and capacity for accommodating more chips. If incorporated, this technology could further bolster South Korea’s position as a leader in chip packaging innovation.
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Conclusion
South Korea’s national project on advanced chip packaging is a pivotal step toward technological advancement and global competitiveness.
The investment aims to bridge technological gaps and foster innovation. Both follower and first mover technologies will be explored to establish South Korea as a prominent player in chip packaging.
Stakeholders anticipate groundbreaking advancements that could reshape the future of semiconductor packaging.
